Atotech Deutschland Gmbh

Christian Wunderlich

Hartmut Mahlkow

Petra Backus

Jürgen Barthelmes

Robert Rüther

Sia-Wing Kok

Nadine Menzel

The invention addresses the problem of improving the adhesion between silver surfaces and resin materials, such as epoxy resins and mold materials, used in the production of electronic devices. The invention provides a method for improving the adhesion between a silver surface and a resin material comprising a step of electrolytically treating the silver surface with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the silver surface is the cathode. In a particular embodiment of this method, the present invention provides a method for producing a surface mounted electronic device comprising the following steps: (i) providing a lead frame having copper and silver surfaces, (ii) electrolytically treating the silver surfaces of the lead frame with a solution containing a hydroxide selected from alkali metal hydroxides, alkaline earth metal hydroxides, ammonium hydroxides and mixtures thereof, wherein the lead frame is the cathode, (iii) encapsulating an electronic device together with the lead frame using a resin material.

Method for improving the adhesion between silver surfaces and resin materials

Process for the production of at least one solderable surface in selected solder regions and of at least one functional surface in function regions differing from the solder regions on circuit carriers provided as well as of corresponding circuit carriers.

Method for producing solderable and functional surfaces on circuit carriers

Method and solution for producing gold coating

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Velten, Germany

Christian Wunderlich