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Heraeus Materials Technology Gmbh & Co. Kg

Hermes Schleifmittel Gmbh

Hermes Schleifkörper Gmbh

Christian Wenzel

Norbert Urbansky

Bernd Schultrich

Peter Siemroth

Thomas Shuelke

Wolfgang Klimes

Siegbert Christiani

Rainer Dohle

Chriffe Omar Belda

Frank Rudolf

Rainer Stabenow

The invention relates to a method for producing a ceramic moulded body, comprising the following steps: a) producing a green body containing ceramic material, binding agents and an organic pore forming agent; b) heating the green body to a temperature higher than the sublimation and/or decomposition temperature of the pore forming agent; c) burning the green body to form a ceramic moulded body. According to the invention, the binding agent comprises polyglycols and fumaric acid.

Method for producing a ceramic moulded body

A connecting wire having an electrically conductive core, preferably provided by a wire or ribbon, with a coating provided on the surface of the core. The coating is composed of a nitrogen-containing tantalum alloy or tungsten alloy, and also optionally contains silicon as an additional alloy component. A manufacturing method for producing such a connecting wire involves passing a wire or ribbon core past a coating source to apply the coating.

Connecting wire and method for manufacturing same

The invention relates to a process and a device for metallization of semiconductor structures, with which areas of the surface can be connected to be electrically conductive using strip conductors in one or a plurality of planes, and contacts between the strip conductors of different planes. The process for producing metallic coatings on semiconductor structures by depositing from a vapor phase under vacuum, in trenches produced for the strip conductors and holes for strip conductor connection in the substrate material such as SiO,or other inorganic and organic materials is characterized in that a known per se pulsed vacuum-arc evaporator is used, a barrier layer being deposited on the surface of the trenches and holes of the substrates using the plasma of the evaporator and/or the trenches and holes being filled with low-impedance strip conductor material from a further plasma of said type of evaporator. The invention describes a device for carrying out the process which can be used, along with the device, to metal-coat trenches and holes with a high aspect ratio without hollow spaces.

Process and device for production of metallic coatings on semiconductor structures

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Dresden, Germany

Christian Wenzel