Epcos Pte Ltd

Sonion Mems A/s

Christian Wang

Peter Ulrik Scheel

Leif Steen Johansen

Jörg Rehder

A miniature microphone assembly comprises a capacitive-microphone transducer, a microphone carrier, and an integrated circuit die. The capacitive-microphone transducer includes a microphone-electrical contact or terminal. The microphone carrier comprises a carrier electrical contact or terminal formed on a first surface of the microphone carrier. An integrated circuit die includes a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a hydrophobic layer or coating. The side surfaces of the integrated circuit die and/or the capacitive-microphone transducer may also include the hydrophobic layer or coating.

Miniature microphone assembly with hydrophobic surface coating

A microphone assembly includes a carrier, a silicon-based transducer, a conducting element, and an underfill agent. The carrier has a first surface holding an electrical contact element. The silicon-based transducer includes a displaceable diaphragm and an electrical contact element. The transducer is arranged at a distance above the first surface of the carrier. The conducting material is arranged to obtain electrical contact between the electrical contact elements of the carrier and the silicon based transducer. The underfill agent is disposed in a space between the silicon based transducer and the silicon based carrier. The underfill agent has an underfill coefficient of thermal expansion, CTE, below 40 ppm/&#xb0; C.

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Copenhagen, Denmark

Christian Wang