At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Tdk Electroncis Ag

At&s Austria Technologie & Systemtechnik Aktiengesellshaft

Tdk Electronics Ag

Christian Vockenberger

Marco Gavagnin

Gernot Grober

Wolfgang Schrittwieser

Mikael Tuominen

Gerald Weis

Sabine Liebfahrt

Rainer Frauwallner

Ahmad Bader Alothman Alterkawi

Thomas Feichtinger

Johannes Stahr

Franz Rinner

Markus Leitgeb

Oliver Dernovsek

Abderrazzaq Ifis

Mike Morianz

Thomas Krivec

Bernhard Reitmaier

Sebastian Sattler

Gerhard Freydl

Ferdinand Lutschounig

Roland Sekavcnik

Gernot Gmundner

Raymond Yi

Naoto Yokoi

Ronald Sekavcnik

An antenna radiation module for assembling to an antenna inlay for a component carrier or to a component carrier. The module includes a dielectric layer structure and an antenna radiation layer structure. The antenna radiation layer structure is embedded in the first dielectric layer structure. Further, an antenna inlay, a component carrier, and a manufacturing method are described.

Antenna layer structures separated by fluid-filled cavity, an antenna inlay, and a component carrier

A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. The at least one electrically conductive layer structure includes a first trace. A tapering trench is formed in the at least one electrically insulating layer structure beside and below the first trace. A method of manufacturing the component carrier is also described.

Component carrier and method of manufacturing a component carrier

A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.

Component carrier with protruding thermally conductive tongue and corresponding method of manufacturing

A packaged integrated circuit includes a core structure with a cavity therein; a component accommodated in the cavity; an electrically insulating structure formed over the core structure and the component; a partially electrically insulating carrier structure formed below the core structure and the component; and an electrically conducting redistribution arrangement formed at least partially within the carrier structure. The redistribution arrangement includes conductor structures each having a first element extending through the carrier structure and electrically connecting a contact of the component and a second element below the carrier structure. A part of the second element is a contact pad for electrically connecting the redistribution arrangement with external circuitry. The carrier structure includes a polyimide layer and an adhesive layer. The adhesive layer is directly attached to an upper surface of the polyimide layer and to a lower surface of the core structure and a lower surface of the component.

Packaged integrated circuit with interposing functionality and method for manufacturing such a packaged integrated circuit

A component carrier is illustrated and described. The component carrier has i) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ii) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier.

Solder-free component carrier connection using an elastic element and method

A method of manufacturing a component carrier, wherein the method comprises mounting a known-good component on or spaced with regard to a first known-good component carrier block, thereafter forming an electrically conductive connection structure on and/or in and/or spaced with regard to the first component carrier block, and embedding the component between the first component carrier block and a second known-good component carrier block.

Embedding known-good component between known-good component carrier blocks with late formed electric connection structure

A component carrier having a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure and an array of exposed highly thermally conductive cooling structures integrally formed with the stack and defining cooling channels in between is disclosed.

Component carrier with integrated thermally conductive cooling structures

An electronic package includes a component carrier having a stepped cavity formed therein; and a component assembly having at least two electrically connected electronic components with different sizes such that the component assembly has a stepped shape. The component assembly is accommodated at least partially inserted within the stepped cavity. Further described is a method of manufacturing such an electric package.

Stepped component assembly accommodated within a stepped cavity in component carrier

A component carrier including a stack of at least one electrically conductive layer structure and at least one electrically insulating layer structure, a component embedded in the stack, and a sealing structure sealing at least part of the component with regard to material of the stack, wherein the sealing structure is configured for reducing stress between the component and the stack.

Configuring a sealing structure sealing a component embedded in a component carrier for reducing mechanical stress

Provided is a method of manufacturing a component carrier that includes forming a magnetic core on a base structure; forming a through hole in at least one dielectric layer; forming a plurality of electrically conductive windings on the at least one dielectric layer around the through hole; forming a stack with the base structure having the magnetic core, the at least one dielectric layer and another base structure such that the magnetic core is inserted into the through hole and the conductive windings are arranged around the magnetic core such that the magnetic core and the plurality of electrically conductive windings are interposed between the base structure and the other base structure.

Component carrier with integrated inductor and manufacturing method

The present invention relates to a carrier () with a passive cooling function for a semiconductor component (), having a main body () with a top side () and a bottom side () and at least one electrical component () that is embedded in the main body (), wherein the carrier () has a first thermal via (), which extends from the top side () of the main body () to the at least one electrical component (), wherein the carrier () has a second thermal via (), which extends from the at least one electrical component () to the bottom side () of the main body (), and wherein the at least one embedded electrical component () is electrically contacted by the first and the second thermal via ().

Carrier with a passive cooling function for a semiconductor component

A component carrier with a stack including a plurality of electrically conductive layer structures and/or electrically insulating layer structures, and a first transistor component and a second transistor component embedded side-by-side in the stack.

Component carrier with transistor components arranged side by side

An electronic device having an electronic component with electric terminals and a component carrier in which the electronic component is packaged. The component carrier includes a shielding cage surrounding all sides of the electronic component at least partially.

Electronic component packaged in component carrier serving as shielding cage

Method of manufacturing a component carrier

The invention relates to an electronic device having an electrically isolating support structure, an electrically conducting conductor path on a surface of the support structure, and an electrically conducting contact structure which extends from the surface into the support structure and is electrically connected to the conductor path at a connection point, thereby forming a common conductor track. The conductor path and the contact structure transition into each other in an enlargement-free manner at the connection point.

Growing community of inventors

Leoben, Austria

Christian Vockenberger