Atotech Deutschland Gmbh

Christian Sparing

Dirk Tews

Heiko Brunner

Martin Thoms

Adrian Zee

Thomas Huelsmann

Arno Clicque

Patrick Brooks

Hartmut Mahlkow

Bernd Froese

Neal Wood

Thomas Hülsmann

Norbert Luetzow

Carl Hutchinson

Arno Clique

A method for pretreating a copper surface for the subsequent formation of a firmly adhesive bond between the copper surface and a plastic material substrate. The method comprises bringing a copper surface into contact with: a) hydrogen peroxide; b) an acid; c) a nitrogen-containing, five-membered, heterocyclic compound; and d) a lactam, amide, or polyamide, connected at one or more of its nitrogen atoms with at least one residue of formula (I), wherein:

Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound

The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I).

To achieve good adherence of a resist coating, more specifically a photo imageable resist coating, to a copper base while ensuring that the copper base being very thin is not compromised, a non-etching non-resist composition for the treatment of the copper base is provided, said composition comprising at least one adhesion agent selected from the group comprising (i) heterocyclic compounds comprising at least one thiol moiety and (ii) quaternary ammonium polymers having the following general chemical formula: {N(R)(R)&#x2014;(CH)&#x2014;N(H)&#x2014;C(Y)&#x2014;N(H)&#x2014;(CH)&#x2014;N(R)(R)&#x2014;R}n X, with R, R, R, R, R, Y and Xbeing defined as claimed.

Non-etching non-resist adhesion composition and method of preparing a work piece

Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of &#x2266;100 &#x3bc;m.

Composition and method for micro etching of copper and copper alloys

The present invention relates to a method for treating copper or copper alloy surfaces for tight bonding to polymeric substrates, for example solder masks found in multilayer printed circuit boards. The substrate generally is a semiconductor-device, a lead frame or a printed circuit board.

Composition and method for improved adhesion of polymeric materials to copper alloy surfaces

Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces, that these layers are very expensive or that the constituents used in manufacturing them are harmful to the environment. Furthermore, the metal surfaces are to be suited to form bond connections as well as electrical contacts. To overcome these problems there are disclosed a bath and a method of electroless plating of silver by way of charge exchange reaction on surfaces of metals that are less noble than silver, more particularly on copper, that contain at least one silver halide complex and not containing any reducing agent for Agions.

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Berlin, Germany

Christian Sparing