Tdk Corporation

Epcos Ag

Christian Siegel

Anton Leidl

Wolfgang Pahl

Matthias Winter

Pirmin Hermann Otto Rombach

Gino Rocca

Gregor Feiertag

Jan Tue Ravnkilde

Klaus Mayer

Jürgen Portmann

Matthias Jungkunz

Ivan Riis Nielsen

Karl Nicolaus

Sebastian Walser

Robert Eichinger

Thomas Wassner

Stefan Stufler

Thomas Sedlmeier

A MEMS device is disclosed. In an embodiment a MEMS device includes a substrate having an active region and at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device to a carrier, wherein the connection element comprises a stress-reducing structure.

MEMS device stress-reducing structure

In a capacitively operating MEMS microphone, by varying the BIAS voltage, the pull-in point is determined and the present pull-in voltage and the corresponding pull-in capacitance between membrane and back electrode are ascertained. From the deviation of the present pull-in point from the values of a first pull-in point, these values being determined after an end test and stored in an internal memory of the MEMS microphone, and the likewise stored values at a first operating point a recalibrated BIAS voltage is determined and set in order thereby to bring the sensitivity closer again to that at the original first operating point.

MEMS microphone and method for self-calibration of the MEMS microphone

A microphone and a method for operating a Microphone are disclosed. In an embodiment the microphone includes a transducer and a mode controller. The microphone has a normal operating mode (M) and a collapse mode (M). The mode controller switches to the collapse mode (M) when an output signal of the transducer reaches or exceeds a predefined threshold value and switches to the normal operating mode (M) when the output signal reaches or falls below a predefined further threshold value (S).

Microphone and method of operating a microphone

The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Method for producing a sensor

A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the &#x2212;3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package.

MEMS microphone

Growing community of inventors

Tuntenhausen, Germany

Christian Siegel