Infineon Technologies Ag

Christian Schweiger

Edward Fuergut

Carsten Von Koblinski

Bernhard Goller

Uwe Hoeckele

Daniel Porwol

Tobias Schmidt

Holger Doepke

Eva-Maria Hess

Claus Von Waechter

Franz Xaver Muehlbauer

Christian Altschaeffl

A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.

Bonded system and a method for adhesively bonding a hygroscopic material

A method for manufacturing a semiconductor device includes providing a carrier and a semiconductor wafer having a first side and a second side opposite to the first side. The method includes applying a dielectric material to the carrier or the semiconductor wafer and bonding the semiconductor wafer to the carrier via the dielectric material. The method includes processing the semiconductor wafer and removing the carrier from the semiconductor wafer such that the dielectric material remains on the semiconductor wafer to provide a semiconductor device comprising the dielectric material.

Semiconductor device including a dielectric material

Growing community of inventors

Pentling, Germany

Christian Schweiger