Valeo Systemes De Controle Moteur

Valeo Equipements Electriques Moteur

Valeo Siemens Eautomotive France Sas

Christian Schwartz

Jean-Yves Moreno

Bruno Lefevre

Roger Deniot

Valery Govindassamy

The method for producing the electric module comprises: securing at least one first electrical component () to a first plate (); then assembling each first electrical component () to an electrical connection bar () to which at least one second component () is already secured.

Electric module, electrical system comprising such an electric module, and corresponding production methods

A production line for producing electronic modules including a printed-circuit board, at least one first-type component, and at least one second-type component, wherein the production line includes a unit for putting the first-type component in place, a general heating unit for melting a solder placed between the at least one first-type component and the circuit, a unit for putting the second-type component in place, and a local heating unit for melting a solder placed between the at least one second-type component and the circuit.

Electronic module produced by sequential fixation of the components

An electrical connection unit for electrically interconnecting two electronic boards, is disclosed. The connection unit includes at least one electrical pin for electrically interconnecting the two boards, a mechanical link part for mechanically interlinking the two boards, where the electrical connection unit is disposed to enable concomitantly the electrical connection of the two boards via the pin and the mechanical link of the two boards via the link part, and a body which simultaneously carries the electrical pin and the mechanical link part, the body including a support portion for receiving and supporting one of the electronic boards, the support portion and the link part being disposed in such a way that the electronic board is held in place by being wedged between the support portion of the body and a point at which the mechanical link part is secured to the board.

Electrical connection unit between two electronic boards

A process for manufacturing an electronic module including a printed-circuit board, at least one first-type component and one second-type component is disclosed. The process involves placing solder on the board, putting the first-type component in a first position, heating the entire board to melt the solder, resulting in soldering of the first-type component, putting the second-type component in a second position such that the second-type component has leads bearing on the board via the solder, and heating the solder locally to melt the solder such that the second-type component is soldered by applying two electrodes on each lead of the second-type component and making an electrical current flow between the electrodes to heat each lead of the second-type component. Each of the two electrodes directly contacts each lead of the second-type component to make the current flow between the two electrodes via the corresponding lead of the second-type component.

Growing community of inventors

Chatou, France

Christian Schwartz