International Business Machines Corporation

Other

Christian Schuster

Young Hoon Kwark

Daniel Michael Kuchta

Mark B Ritter

Zhaoqing Chen

Albert E Ruehli

Brian Paul Gaucher

An electrical device includes a plurality of interconnects passing through a plane. The interconnects have a longitudinal axis substantially perpendicular to the plane and including an arrangement pattern which reduces or eliminates cross-talk between nearest neighboring interconnects, wherein the interconnects include a first differentially driven signal conductor pair and at least one other signal conductor, and the arrangement includes the at least one other signal conductor disposed at a substantially same distance from each conductor of the first differentially driven signal conductor pair.

Crosstalk reduction in electrical interconnects using differential signaling

A circuit includes an input signal line, a high performance resonant element connected to the input signal line, and an output signal line connected to the high performance resonant element. The high performance resonant element is a via.

High performance resonant element

A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

An RF device includes a signal layer disposed over a ground plane having radio frequency (RF) transmission lines configured and dimensioned to provide impedance matching along the RF lines. A shield is formed as a part of the RF lines and disposed below the RF choke of a DC current supply to form an intermediate capacitance between the choke and the shield to control parasitic effects.

Impedance matching circuit with simultaneous shielding of parasitic effects for transceiver modules

A method for fabricating a transceiver, which simultaneously provides impedance matched transmission for radio frequency (RF) and shields against transmission losses due to parasitic effects includes identifying parasitic electromagnetic elements associated with an RF choke for a given placement on a substrate. RF lines are placed and dimensioned on the bench to form impedance matched RF lines wherein a portion of the RF lines shield the RF choke for a given bandwidth such that impedance matching and control of parasitic effects of the RF choke are simultaneously provided wherein an intermediate capacitance formed between the RF choke and the shield is sized to balance against the parasitic effects to provide a desired transmission response over a selected frequency range.

A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers interspersed between the non-conductive layers, vias extending through the non-conductive layers and the conductive layers, radio frequency absorbing material within each of the vias, where the radio frequency absorbing material is at a conductive layer within the printed circuit board at which a conductive trace is not connected to a via, an insulating layer over each radio frequency absorbing material, and a cylindrical conductive material within via and over each insulating layer.

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Yorktown Heights, NY, United States of America

Christian Schuster