Schweizer Electronic Ag

Christian Roessle

Thomas Gottwald

Alexander Neumann

A method for producing a radio frequency transmitting/receiving element comprising at least one radio frequency antenna and at least one radio frequency chip, and to a corresponding radio frequency transmitting/receiving element made by the method. The method comprises the following steps: providing a temporary rigid carrier; applying a conductor pattern structure comprising the antenna structure of the at least one radio frequency antenna and connection contacts&#x2014;connected thereto via leads&#x2014;for the at least one radio frequency chip; arranging the at least one radio frequency chip on the connection contacts of the conductor pattern structure; applying an electrically insulating layer on the conductor pattern structure, such that the at least one radio frequency chip is surrounded by the electrically insulating layer; and removing the temporary rigid carrier.

Radio frequency transmitting/receiving element and method for producing a radio frequency transmitting/receiving element

The invention relates to an electronic component, namely a printed circuit board element comprising a first semiconductor component () which is arranged on an upper side of an electrically conductive intermediate plate () such that a connector pad () of the semiconductor component () is electrically contacted with the intermediate plate () and comprising a second semiconductor component () which is arranged on a lower side of the intermediate plate (). The second semiconductor component () comprises a first connector pad () and a second connector pad (), wherein both connector pads () are aligned in the direction of the intermediate plate () and wherein the first connector pad () is contacted with the intermediate plate (), and wherein the second connector pad () is not contacted with the intermediate plate (). Moreover, the invention relates to a method for producing such a printed circuit board element.

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St. Georgen, Germany

Christian Roessle