Hitachi Global Storage Technologies Netherlands B.v.

Hgst Netherlands, B.v.

Christian René Bonhôte

Quang Le

Jeffrey Scott Lille

Toshiki Hirano

Vladimir Nikitin

Barry C Stipe

Aron Pentek

Neil Leslie Robertson

Fu-Ying Huang

Ricardo Ruiz

Linden James Crawforth

Georges Gibran Siddiqi

An integrated circuit has a doped silicon semiconductor with regions of insulators and bare silicon. The bare silicon regions are isolated from other bare silicon regions. A semiconductor device on the doped silicon semiconductor has at least two electrical connections to form regions of patterned metal. A metal is electroplated directly on each of the regions of patterned metal to form plated connections without a seed layer. A self-aligned silicide is located under each plated connection, formed by annealing, for the regions of plated metal on bare silicon.

System, method and apparatus for seedless electroplated structure on a semiconductor substrate

The present invention generally relates to fabricating a bond pad for electrically connecting a laser diode to a slider and a TAR head in a HDD. The bond pad is deposited on a surface of the head that is perpendicular to the air bearing surface (ABS). The head is diced and lapped to expose the bond pad on a top surface of the head and mounted on a slider. The laser diode and a sub-mount may be coupled to the top surface of the slider&#x2014;i.e., the surface opposite the ABS&#x2014;by connecting to the bond pads. Specifically, both the laser diode and the sub-mount have electrodes thereon that are perpendicular to the bond pads. Conductive bonding material is used to bond the laser diode and the sub-mount to the bond pads.

Method for electrically connecting an energy source to a head of a disk drive

A system according to one embodiment includes a write pole having an end region positioned towards an air bearing surface, a first flare point, and a second flare point positioned between the air bearing surface and the first flare point; and a shield positioned above the write pole, wherein a cross sectional area of the write pole at a point between the first and second flare points along a plane passing through the write pole and oriented about parallel to the air bearing surface is greater than a cross sectional area of the end region of the write pole along a plane oriented parallel to the plane passing through the second flare point. Additional systems and methods are also presented.

Write head with self-align layer and a method for making the same

Methods suitable for use in making a write coil of a magnetic head includes the steps of forming a seed layer made of ruthenium (Ru) over a substrate; forming, over the seed layer, a patterned resist having a plurality of write coil trenches patterned therein; electroplating electrically conductive materials within the plurality of write coil trenches to thereby form a plurality of write coil layers; removing the patterned resist; and performing a reactive ion etch (RIE) in ozone gas (O) for removing exposed seed layer materials in between the plurality of write coil layers. Advantageously, the write coil layers remain undamaged from the RIE in the ozone gas. Other structures may be fabricated in a similar manner.

Method for use in making a write coil of magnetic head

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San Jose, CA, United States of America

Christian René Bonhôte