Lam Research Ag

Christian Putzi

David S Mui

Butch Berney

Karl-Heinz Hohenwarter

Reinhold Schwarzenbacher

Bhaskar Bandarapu

Hongbo Si

Robert Johnson

Bernhard Loidl

Nathan Lavdovsky

Michael Klemm

A vapor delivery head for wet treatment of a substrate includes a body including an upper surface, a lower surface, an upper plenum and a lower plenum. A first bore is arranged on the upper surface of the body and fluidly connected to the upper plenum to supply heated fluid. A second bore is arranged on the upper surface of the body and connected to the upper plenum to remove heated fluid. A third bore is arranged on the upper surface of the body and connected to the lower plenum to receive a gas mixture. A plurality of through holes through the lower surface of the body are in fluid communication with the lower plenum.

Vapor delivery head for preventing stiction of high aspect ratio structures and/or repairing high aspect ratio structures

A method and device for processing wafer-shaped articles includes a spin chuck for holding and rotating a wafer-shaped article about a rotation axis, and at least one dispenser for dispensing a fluid onto at least one surface of a wafer-shaped article. A collector surrounds the spin chuck for collecting process fluids, with at least two collector levels for separately collecting fluids in different collector levels. Each collector level comprises an exhaust gas collecting chamber leading to a respective exhaust gas conduit. At least one of the exhaust gas conduits comprises a valve mechanism that reciprocally restricts exhaust gas flow from its associated exhaust gas conduit while opening the exhaust gas conduit to an ambient environment outside the collector, and vice-versa.

Method and apparatus for processing wafer-shaped articles

Growing community of inventors

Rosenbach, Austria

Christian Putzi