Rohde and Schwarz Gmbh & Co. Kg

Christian Pinta

Gerd Hechtfischer

Mathias Nagel

Wilhelm Hohenester

Ralf Jünemann

Rupert Huber

Bertrand Thomas

Achim Walber

Monika Völk

Ralf JÜNEMANN

Monika VÖLK

A high-frequency substrate contains a carrier substrate, which has at least one fastening element. The fastening element is deposited on the outer region of the carrier substrate and protrudes over the outer region of the carrier substrate.

High-frequency substrate and manufacturing method for high-performance, high-frequency applications

A substrate-based circuit () provides a carrier substrate (), wherein a bond layer () is embodied on at least one part of the carrier substrate (), and wherein a contact layer () which forms at least one conductor line () and/or at least one antenna element () is embodied on at least one first part () of the bond layer (). The carrier substrate () provides at least one fastening element (), which is deposited at the outer region of the carrier substrate () and projects beyond the outer region of the carrier substrate ().

Circuit on a thin carrier for use in hollow conductors and a manufacturing method

A calibration unit for a measurement device for connecting to a connector embodied in a coaxial manner. The calibration unit provides a housing and an inner conductor, whereas the inner conductor () is embodied centered within an aperture of the housing. The calibration unit provides a connecting element, that the connecting element is inserted into the aperture of the housing and hosts the inner conductor and that the connecting element is embodied in an elastic manner and supports the inner conductor in an elastic manner relative to the housing.

Calibration unit for a measurement device

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Munich, Germany

Christian Pinta