Nxp B.v.

Christian Paquet

James Raymond Spehar

Dominicus M Roozeboom

Theo Kersjes

Wayne A Nunn

Fatha Khalsa

Padraig O'Mahony

Frank Caris

Joseph E Schulze

One embodiment of the present application includes a multisensor assembly. This assembly has an electromechanical motion sensor member defined with one wafer layer, a first sensor carried with a first one or two or more other wafer layers, and a second sensor carried with a second one of the other wafer layers. The one wafer layer is positioned between the other wafer layers to correspondingly enclose the sensor member within a cavity of the assembly.

Electromechanical sensor apparatus and methods with multisensing aspects

A high bandwidth circuit is segmented into a plurality of portions, each portion for implementation on a corresponding semiconductor chip, an arrangement of one or more die bond pads for each corresponding chip is generated, and a chip location for each corresponding chip is generated, given package and given package I/O arrangement is generated, the generation of the die bond arrangements and the chip position being relative to given chip package parameters, and being generated to establish bond wire lengths meeting given characteristic impedance parameters. Boundary parameters for generating the segmenting are provided, including a bound on the number of portions and optionally a including bound on the area parameters of the corresponding semiconductor chips.

Impedance optimized chip system

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Cupertino, CA, United States of America

Christian Paquet