Intel Corporation

Intel Mobile Communications Gmbh

Intel Deutschland Gmbh

Christian Mueller

Reinhard Mahnkopf

Thorsten Meyer

Andreas Augustin

Christian Geissler

Gerald Ofner

Hans-Joachim Barth

Sven Albers

Harald Gossner

Georg Seidemann

Michael P Skinner

Wolfgang Molzer

Teodora Ossiander

A chip arrangement may include: a mold compound; and a microelectromechanical systems device at least partially embedded in the mold compound.

Chip arrangement and method for manufacturing a chip arrangement

Stress buffer layers for integrated microelectromechanical systems (MEMS) are described. For example, a semiconductor package includes a substrate having first and second surfaces, the second surface having an array of external conductive contacts. A microelectromechanical system (MEMS) component is disposed above the first surface of the substrate. A buffer layer is disposed above the MEMS component, the buffer layer having a first Young's modulus. A mold compound is disposed above the buffer layer, the mold compound having a second Young's modulus higher than the first Young's modulus.

Stress buffer layer for integrated microelectromechanical systems (MEMS)

An apparatus comprises a first integrated circuit (IC) die that includes a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, a second IC die including a top layer, a bottom surface, a sidewall surface extending from a top surface of the top layer to the bottom surface, and at least one multi-surface contact pad, wherein the second IC die is arranged adjacent to the first IC die, and includes an electrically conductive bond in contact with at least one of the top surface or the side surface of the multi-surface contact pad of the first IC die and the top surface of the multi-surface contact pad of the second IC die.

Die edge side connection

A chip arrangement may include: a first chip including a first contact, a second contact, and a redistribution structure electrically coupling the first contact to the second contact; a second chip including a contact; and a plurality of interconnects electrically coupled to the second contact of the first chip, wherein at least one interconnect of the plurality of interconnects electrically couples the second contact of the first chip to the contact of the second chip.

Chip arrangements

Growing community of inventors

Bottrop, Germany

Christian Mueller