General Electric Company

Christian M Giovanniello

Gamal Refai-Ahmed

John Anthony Vogel

Hendrik Pieter Jacobus De Bock

Yogen Vishwas Utturkar

Arun Virupaksha Gowda

Christopher Fred Keimel

David Mulford Shaddock

Avinash Srikrishnan Kashyap

Bryan Patrick Whalen

Matthew A Ferguson

A surge suppression device includes a micro electromechanical system (MEMS) switch electrically connected to a current path. Additionally, the surge suppression device includes a transient voltage suppression (TVS) device electrically connected in series to the MEMS switch. The surge suppression device is configured to protect electronic components from voltage surges or current surges.

Low capacitance surge suppression device

A thermal management system that provides cooling to an electronic device is disclosed. The thermal management system includes a surface having a plurality of extended elements thermally coupled to the surface, a plurality of vibrator assemblies configured to generate a cooling flow across the surface, and a mounting structure disposed atop the plurality of extended elements of the surface to position the plurality of vibrator assemblies relative to the surface. The mounting structure is configured to orient each of the plurality of vibrator assemblies to the surface at an angel, such that the cooling flow generated by the plurality of vibrator assemblies impinges on the extended elements at an angle.

Integrated compact impingement on extended heat surface

A vibrational fluid mover includes a housing having at least one actuator element positioned thereon that vibrates responsive to a wave shape voltage applied thereto, such that a volume of a chamber in the housing increases and decreases to entrain and eject fluid into/out from the chamber. A control system is operably connected to the actuator element to cause the voltage to be provided thereto so as to actively control the movement of the actuator element. The control system is programmed to set a baseline value for an operational parameter of the vibrational fluid mover generated responsive to a target voltage and frequency being provided, monitor operation of the vibrational fluid mover during operation at the target voltage and frequency, identify a deviation of the operational parameter from the baseline value, and modify the voltage and frequency provided to the actuator element based on any deviation of the operational parameter.

Vibrational fluid mover active controller

A vibrational fluid mover assembly having an active damping mechanism is disclosed. The vibrational fluid mover assembly includes a vibrational fluid mover having a first plate, a second plate spaced apart from the first plate, a spacer element having an orifice formed therein and being positioned between the first and second plates to maintain the first and second plates in a spaced apart relationship, and an actuator element coupled to at least one of the first and second plates to selectively cause deflection thereof such that a fluid flow is generated and projected out from the orifice. The vibrational fluid mover assembly also includes an absorber system connected to the vibrational fluid mover and providing active damping to the vibrational fluid mover, with the absorber system having suspension tabs coupled to the vibrational fluid mover and spring components configured to mount the vibrational fluid mover in a suspended arrangement.

Vibrational fluid mover jet with active damping mechanism

An electronic device includes an outer case defining an internal volume, a circuit board positioned within the internal volume and having a first surface and a second surface, one or more active components mounted on the first surface of the circuit board, and a thermal management system to provide cooling for the active components. The thermal management system includes a first heat spreader in thermal contact with an active component, a second heat spreader in thermal contact with the second surface of the circuit board, thermal carriers coupled to the first and second heat spreaders to remove thermal energy therefrom, and a heat exchanger coupled to the thermal carriers to receive thermal energy therefrom and dissipate the thermal energy, wherein one thermal carrier is routed between the first heat spreader and the heat exchanger and the other thermal carrier is routed between the second heat spreader and the heat exchanger.

Thermal clamp apparatus for electronic systems

An electronic packaging assembly having a semiconductor integrated circuit and a plurality of interconnect components is provided. The plurality of interconnect components is operatively coupled to the semiconductor integrated circuit. Further, one or more interconnect components include one or more support elements having a first surface and a second surface, and one or more spring elements having a first end and a second end, and wherein first ends of the one or more spring elements are coupled to the first surface or the second surface of a respective support element.

Growing community of inventors

Schenectady, NY, United States of America

Christian M Giovanniello