Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Osram Oledgmbh

Osram Otpo Semiconductors Gmbh

Osram Otpo Gmbh

Christian Leirer

Korbinian Perzlmaier

Tobias Meyer

Anna Kasprzak-Zablocka

Isabel Otto

Berthold Hahn

Matthias Peter

Andreas Löffler

Thomas Schwarz

Rainer Butendeich

Alexander Walter

Adam Bauer

Karl Engl

Joachim Hertkorn

Johannes Baur

Andreas Biebersdorf

Markus Maute

Jürgen Off

Lorenzo Zini

Andreas Loeffler

Juergen Off

Stefanie Rammelsberger

Christian Rumbolz

Anton Vogl

Dario Schiavon

Frank Singer

Siegfried Herrmann

Lutz Höppel

Martin Rudolf Behringer

Andreas Ploessl

Dominik Scholz

Simeon Katz

Ulrich Steegmüller

Roland Zeisel

Michael Schumann

Christine Rafael

Christian Mueller

Robert Schulz

Julian Ikonomov

Björn Hoxhold

Tobias Gotschke

An optoelectronic arrangement is specified, including a moulded body having a base surface, a first pixel group with a multiplicity of pixels assigned thereto, each having a first semiconductor region, a second semiconductor region and an active region, a multiplicity of separating structures arranged between the pixels, and at least one first contact structure having a first contact plane and a first contact location, which is freely accessible at the base surface, wherein the pixels of the first pixel group are arranged alongside one another at the top surface, the first semiconductor regions and/or the second semiconductor regions of adjacent pixels of the first pixel group are electrically insulated from one another by means of the separating structures, a first contact structure is assigned one-to-one to the first pixel group, and the first semiconductor regions of the pixels of the first pixel group are electrically conductively connected to one another by means of the first contact plane and are electrically contactable by means of the first contact location.

Optoelectronic arrangement and method for producing an optoelectronic arrangement

In an embodiment, the semiconductor device is surface mountable and comprises a light emitting semiconductor chip which comprises electrical contact pads. An opaque base body laterally surrounds the semiconductor chip. An electrical fanning layer contains electrical conductor tracks. Electrical connection pads are used for external electrical contacting of the semiconductor device. The contact pads and the connection pads are located on different sides of the fanning layer. The contact pads are electrically connected to the associated connection pads by means of the fanning layer. The connection pads are expanded relative to the contact pads.

Surface mountable optoelectronic semiconductor device and method for manufacturing a surface mountable optoelectronic semiconductor devices

In an embodiment a measuring unit includes a light emitting LED component including a housing occupying a housing surface G and an LED chip located within the housing, the LED chip including a light emitting light surface L and being configured to emit light; a photodetector configured to detect reflected light reflected from a measured object originating from the LED component and output a measurement signal dependent on a detection of the reflected light; and an integrated circuit configured to evaluate the measurement signal, wherein the LED component, the photodetector, and the integrated circuit are combined into an integrated unit; and a conversion layer disposed in the housing and located above the LED chip, the conversion layer configured to convert the light into multiband light, wherein a ratio L/G of is greater than or equal to 0.8, and wherein the measuring unit is configured to optically measure at least one property of the measured object.

Compact multi-band optical measuring unit

An optoelectronic arrangement is specified, comprising a moulded body having a base surface, a first pixel group with a multiplicity of pixels assigned thereto, each having a first semiconductor region, a second semiconductor region and an active region, a multiplicity of separating structures arranged between the pixels, and at least one first contact structure having a first contact plane and a first contact location, which is freely accessible at the base surface, wherein the pixels of the first pixel group are arranged alongside one another at the top surface, the first semiconductor regions and/or the second semiconductor regions of adjacent pixels of the first pixel group are electrically insulated from one another by means of the separating structures, a first contact structure is assigned one-to-one to the first pixel group, and the first semiconductor regions of the pixels of the first pixel group are electrically conductively connected to one another by means of the first contact plane and are electrically contactable by means of the first contact location.

A semiconductor component may include a semiconductor body having a first semiconductor layer and a second semiconductor layer, a first main face and a second main face, opposite from the first main face, the first main face being formed by a surface of the first semiconductor layer and the second main face being formed by a surface of the second semiconductor layer. At least one side face may join the first main face to the second main face, an electrically conducting carrier layer, which covers the second main face at least in certain regions and extends from the second main face to at least one side face of the semiconductor body. An electrically conducting continuous deformation layer may cover the second main face at least in certain regions. The electrically conducting deformation layer may have an elasticity that is identical to or higher than the electrically conducting carrier layer.

Semiconductor component comprising a deformation layer and method for producing a semiconductor component comprising a deformation layer

A method of manufacturing semiconductor device includes providing a radiation emitting semiconductor chip having a first main surface, applying a metallic seed layer to a second main surface opposite the first main surface, galvanically depositing first and second metallic volume regions on the seed layer, depositing an adhesion promoting layer on the volume regions, and applying a casting compound at least between contact points, wherein before the metallic volume regions are galvanically deposited, a dielectric layer is first applied to the seed layer over its entire surface and openings are produced in the dielectric layer by etching, and a material of the metallic volume regions is deposited through the openings of the dielectric layer, wherein the dielectric layer is underetched at boundaries to the openings and the underetches are filled with material of the metallic volume regions during the galvanical depositing of the metallic volume regions.

Method of producing a radiation-emitting semiconductor component, and radiation-emitting semiconductor component

An optoelectronic semiconductor chip includes a rear side with a center and with two contact points for electrical contacting of the semiconductor chip, the contact points being spaced apart from one another, and two solder pads arranged on the contact points, wherein the center is located in a region between the contact points, the solder pads protrude from the rear side and are exposed, and on average, the solder pads are thicker further away from the center than in the vicinity of the center or vice versa.

Solder pads of variable thickness in an optoelectronic semiconductor chip, on a connection substrate for mounting a semiconductor chip, method of producing an optoelectronic component, and optoelectronic component having the solder pads

A method for manufacturing a radiation-emitting semiconductor device and radiation-emitting semiconductor device are disclosed. In an embodiment a method includes providing a radiation-emitting semiconductor chip having a first main surface including a radiation exit surface of the semiconductor chip, applying a metallic seed layer to a second main surface of the semiconductor chip opposite to the first main surface, galvanically depositing a first metallic layer on the seed layer for forming a first electrical contact point and a second electrical contact point, galvanically depositing a second metallic layer on the first metallic layer for forming the first electrical contact point and the second electrical contact point, wherein a material of the first metallic layer and a material of the second metallic layer are different, and applying a casting compound between the contact points.

Method for manufacturing a radiation-emitting semiconductor component and radiation-emitting semiconductor component

A semiconductor component may have a semiconductor body and an electrically conductive carrier layer. The semiconductor body may include a first semiconductor layer and a second semiconductor layer, a first main face and a second main face, situated opposite the first main face, wherein the first main face is formed by a surface of the first semiconductor layer and the second main face is formed by a surface of the second semiconductor layer. The semiconductor body may further include at least one side face connecting the first main face to the second main face. The electrically conductive carrier layer may regionally cover the second main face the carrier layer is structured in such a way that it has at least one contact-free depression. Furthermore, a method for producing such a semiconductor component is disclosed.

Semiconductor component and method for producing a semiconductor component

A method of manufacturing an optoelectronic semiconductor chip includes a) providing a semiconductor layer sequence having an active region that generates or receives radiation on a substrate; b) forming at least one recess extending through the active region; c) forming a metallic reinforcement layer on the semiconductor layer sequence by galvanic deposition, the metallic reinforcement layer completely covering the semiconductor layer sequence and at least partially filling the recess; and d) removing the substrate, wherein the metallic reinforcement layer is leveled on a side facing away from the semiconductor layer sequence.

Method of manufacturing an optoelectronic semiconductor chip and optoelectronic semiconductor chip

A method for producing an optoelectronic semiconductor component and an optoelectronic semiconductor component are disclosed. In an embodiment a method include providing a semiconductor layer sequence having an active region and a plurality of emission regions, forming a plurality of first contact points, filling spacings between the first contact points with a molding compound, removing a growth substrate of the semiconductor layer sequence and arranging the semiconductor layer sequence on a connection carrier comprising a control circuit and a plurality of connection surfaces, wherein each of the first contact points is electrically conductively connected to a connection surface, wherein the emission regions are independently controllable by the control circuit, and wherein the molding compound serves as a temporary auxiliary carrier that mechanically stabilizes the semiconductor layer sequence during the removal of the growth substrate.

Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

A semiconductor chip includes an electrically insulating layer including a first opening and a second opening, an electrically conductive first connection point, and an electrically conductive second connection point, wherein a carrier mechanically connects to a semiconductor body, the active region electrically connects to a first conductor body and a second conductor body, the electrically insulating layer covers the carrier on a side thereof facing away from the semiconductor body, the first connection point electrically connects to the first conductor body through the first opening, the second connection point electrically connects to the second conductor body through the second opening, the first conductor body is at a first distance from a second conductor body, the first connection point is at a second distance from the second connection point, and the first distance is less than the second distance.

Optoelectronic semiconductor chip

A method for producing an optoelectronic device is disclosed. The method include preforming an inductive excitation of a current by an inductive component of the optoelectronic device such that the optoelectronic device emits electromagnetic radiation, measuring of at least one electro-optical characteristic of the optoelectronic device and applying a converter material to an emission side of the optoelectronic device, wherein a quantity of the converter material is determined from the measurement of the electro-optical characteristic.

Method for producing an optoelectronic device

An optoelectronic arrangement is specified, comprising a moulded body () having a base surface (), a first pixel group () with a multiplicity of pixels () assigned thereto, each having a first semiconductor region (), a second semiconductor region () and an active region (), a multiplicity of separating structures () arranged between the pixels (), and at least one first contact structure () having a first contact plane () and a first contact location (), which is freely accessible at the base surface (), wherein the pixels () of the first pixel group () are arranged alongside one another at the top surface (), the first semiconductor regions () and/or the second semiconductor regions () of adjacent pixels () of the first pixel group () are electrically insulated from one another by means of the separating structures (), a first contact structure () is assigned one-to-one to the first pixel group (), and the first semiconductor regions () of the pixels () of the first pixel group () are electrically conductively connected to one another by means of the first contact plane () and are electrically contactable by means of the first contact location ().

The invention relates to a semiconductor component comprising: a semiconductor chip () which has a semiconductor body () with an active region () and a substrate () with a first conductor body (), a second conductor body () and a first moulded body (); and a second moulded body (); wherein the second moulded body () completely surrounds the semiconductor chip () in lateral directions (L), the semiconductor chip () extends all the way through the second moulded body () in a vertical direction (V), at least some parts of an upper side and a lower side of the semiconductor chip () are not covered by the second moulded body (), the substrate () is mechanically connected to the semiconductor body (), the active region () is connected to the first conductor body () and the second conductor body () in an electroconductive manner, and the second moulded body () is directly adjacent to the substrate () and the semiconductor body ().

Semiconductor component comprising a first and a second shaped body and method for producing a semiconductor component comprising a first and a second shaped body

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Friedberg, Germany

Christian Leirer