Microsoft Technology Licensing, LLC

Elwha LLC

Christian L Belady

Eric Clarence Peterson

Sean Michael James

Husam Atallah Alissa

Shaun L Harris

Bharath Ramakrishnan

Winston Allen Saunders

Ioannis Manousakis

Douglas M Carmean

Nicholas Andrew Keehn

Hitesh Ballani

Paolo Costa

Ricardo Gouvea Bianchini

Brian A Janous

Mark Edward Shaw

Marcus Felipe Fontoura

David Thomas Gauthier

Mark Alan Monroe

Stephan W Gilges

Lisa Ru-feng Hsu

Charles Joseph Williams

Vaidehi Oruganti

Lisa Ru-Feng Hsu

Brian Andersen

Daniel Gerard Costello

Jie Jerry Liu

Sriram Sankar

Gregory Joseph McKnight

Darren Arthur Shakib

David Tennyson Harper, Iii

Osvaldo Patricio Morales

Gabriel Kliot

Scott Thomas Seaton

Chia-Chi Lin

Allan Joseph Wenzel

Cheerei Cheng

Jens Conrad Housley

Lowell L Wood, Jr

Roderick A Hyde

Clarence T Tegreene

Jordin T Kare

Nathan P Myhrvold

Muriel Y Ishikawa

Victoria Y H Wood

Charles Whitmer

William Henry Gates, Iii

Tony S Pan

James Robert Hamilton

Yaroslav Aleksandrovich Urzhumov

Craig J Mundie

Charles Walter Boecker

Navendu Jain

James R Larus

Max Nathan Mankin

Danny Allen Reed

Christian Herwarth Borgs

Jennifer Tour Chayes

Brandon Aaron Rubenstein

Ishai Menache

Dennis Trieu

Kai Shi

Robert Jason Lankston

Joseph M Sherman

Harry Raymond Rogers

Ehsan Nasr Azadani

Matthew Allen Faist

Ilan Lobel

Sean Patrick Abbott

Brian Jon Mattson

Kenneth Allen Lundgren

Hamid Nazerzadeh

T Varugis Kurien

Frank J Wirtz

Eric J Horvitz

Sompong Paul Olarig

Douglas Patrick Kelley

John Joseph Siegler

Ashish Raniwala

Suyash Sinha

Michael Rees Helsel

Alok Gautam Kumbhare

Ruslan Nagimov

Ricardo Gouvêa Bianchini

Nithish Mahalingam

Kathryn M Oseen-senda

Kyle Edward Woolcock

Lalu Vannankandy Kunnath

Brijesh Warrier

Sreenivas Addagatla

Kristofer Andrew Johnson

Steven Solomon

Ame M Josefsberg

J Darrin Schroeder

Rodrigo Lemos De Assis

Upshur Bagwell Quinby, V

Maria Leena Kyllikki Viitaniemi

Teresa A Nick

Anthony Joseph Bianchi

Stephan Wayne Gilges

Gregory Joseph Mcknight

Techniques for controlling cooling of electronic components in computing facilities are disclosed herein. In one embodiment, a method includes detecting a pressure drop of a coolant flowing across multiple servers in an enclosure between the inlet and outlet manifolds and a supply temperature of the coolant at the inlet manifold. The method further includes automatically adjust operations of the pump to maintain the calculated pressure drop at or near a pressure-drop setpoint while automatically adjusting operations of the air mover to maintain the supply temperature at or near a temperature setpoint.

Control systems for air-assisted and liquid-cooled enclosures

A thermal management system for cooling electronic devices includes an immersion cooling system, a vapor buffer tank, and a liquid buffer tank. The immersion cooling system includes an immersion tank defining an immersion chamber, a working fluid in the immersion chamber, and a condenser. A liquid portion of the working fluid defines an immersion bath in the immersion chamber and a vapor portion defines a headspace above the immersion bath in the immersion chamber. The condenser condenses the vapor portion of the working fluid to the liquid portion of the working fluid. The vapor buffer tank is in fluid communication with the headspace, and a vapor valve selectively allows fluid communication between the vapor buffer tank and the headspace. The liquid buffer tank is in fluid communication with the immersion chamber, and a liquid valve selectively allows fluid communication between the liquid buffer tank and the immersion chamber.

Systems and methods for immersion-cooled datacenters

A thermal management system includes an air handling unit (AHU) configured to receive outside air (OA) from an OA intake, and water from a water source, where the AHU is configured to direct conditioned air toward a cold aisle and the AHU includes a modular adiabatic layer containing an evaporative media, and the modular adiabatic layer includes a plurality of subregions configured to be wetted by the evaporative media independently of one another.

Systems and methods for cooling datacenters

A system for efficiently interconnecting computing nodes can include a plurality of computing nodes and a plurality of network switches coupled in parallel to the plurality of computing nodes. The system can also include a plurality of node interfaces. Each computing node among the plurality of computing nodes can include at least one node interface for each network switch among the plurality of network switches. The plurality of node interfaces corresponding to a computing node can be configured to send data to another computing node via the plurality of network switches. The system can also include a plurality of switch interfaces. Each network switch among the plurality of network switches can include at least one switch interface for each computing node among the plurality of computing nodes. A switch interface corresponding to the computing node can be coupled to a node interface corresponding to the computing node.

Efficiently interconnecting computing nodes to enable use of high-radix network switches

A power controller allocates input power to a datacenter between computing power for computing services, backup power, and overhead power for overhead systems. The power controller reallocates the overhead power and/or the backup power to the computing power. This may increase the overall utilization of the datacenter by allowing additional processing power of the servers to be used.

Allocating power between overhead, backup, and computing power services

A method for encoding data in a datacenter is provided that includes obtaining data to be encoded, encoding the data to a set of encoded spatiotemporal patterns, and outputting the set of encoded spatiotemporal patterns.

Methods for transmitting data via free space spatiotemporal patterns

An electronic device includes a substrate having a first surface and an opposite second surface; a photonic transmitter supported by the first surface of the substrate; a photonic receiver supported by the first surface of the substrate; a microfluidic volume positioned in the second surface of the substrate; a waveguide positioned to direct photonic signal from the photonic transmitter to the photonic receiver, wherein at least a portion of the waveguide is positioned between the first surface of the substrate and at least a portion of the microfluidic volume; and a working fluid in the microfluidic volume to receive heat from the waveguide.

Liquid powered and cooled microfluidics photonics architecture

The disclosed technology is generally directed to vapor-air transition detection for two-phase liquid immersion cooling. In one example of the technology, a first device is cooled via two-phase liquid immersion cooling, such that the first device is submerged in a dielectric liquid in a system, and such that a boiling temperature of the dielectric liquid is a temperature that is suitable for keeping the first device cool. A portion of a first strip that is disposed in the system above the dielectric liquid is cooled. The first strip is composed of a thermo-conductive material. While the portion of the first strip is being cooled, via the first strip, a location of a vapor-air boundary in the system is determined based on a detected temperature along a length of the first strip.

Vapor-air transition detection for two-phase liquid immersion cooling

A liquid-submersible thermal management system includes a cylindrical outer shell and an inner shell positioned in an interior volume of the outer shell. The cylindrical outer shell has a longitudinal axis oriented vertically relative to a direction of gravity, and the inner shell defines an immersion chamber. The liquid-submersible thermal management system a spine positioned inside the immersion chamber and oriented at least partially in a direction of the longitudinal axis with a heat-generating component located in the immersion chamber. A working fluid is positioned in the immersion chamber and at least partially surrounding the heat-generating component. The working fluid receives heat from the heat-generating component.

A processing unit includes a first die and a second die with a microfluidic volume between the first die and the second die. At least one heat transfer structure couples the first die to the second die and is located in the microfluid volume. An electrochemical fluid is positioned in the microfluidic volume to provide electrochemical energy to at least one of the first die and the second die and receive heat from the first die and the second die.

Ultra dense processors with embedded microfluidic cooling

A processor includes a first die, a second die connected to the first die with a microfluidic volume positioned between the first die and the second die, a wicking heat spreader positioned in the microfluidic volume; and a boiling enhancement surface feature positioned on at least one surface of the wicking heat spreader.

3-D structured two-phase microfluidic cooling with nano structured boiling enhancement coating

Techniques for dynamically changing a pressure within a pressurized cooling system to thereby allow different cooling rates to be used to cool electronic equipment are disclosed. A pressurized cooling system cools electronic heat generating components using dielectric heat transfer fluid disposed within a two-phase immersion cooling container. This container is operable to maintain different pressure levels. The pressurized cooling system includes a pressure system structured to modify a pressure within the container. The system operates in a first state when the pressure is above a threshold pressure. The system operates in a second state when the pressure is at the threshold pressure. The system operates in either one of the first state or the second state based on an operating state of the heat generating component.

Pressure based phase immersion cooling system

A method of thermal management of a computing device includes immersing a first electronic component of the computing device in a first working fluid contained in a first volume, immersing a second electronic component of the computing device in a second working fluid contained in a second volume, and changing a pressure in the first volume to alter a boiling temperature of the first working fluid in the first volume.

Systems and methods for thermal management of high-capacity devices in immersion-cooled datacenters

A liquid-submersible thermal management system includes a shell, a heat-generating component, a working fluid, and at least one heat-dispersing element. The shell defines an immersion chamber where the heat-generating component is located in the immersion chamber. The working fluid is positioned in the immersion chamber and at least partially surrounds the heat-generating component so the working fluid receives heat from the heat-generating component. The at least one heat-dispersing element is positioned on exterior surface of the shell to conduct heat from the shell into the heat-dispersing element.

Growing community of inventors

Mercer Island, WA, United States of America

Christian L Belady