Infineon Technologies Austria Ag

Christian Kasztelan

Nee Wan Khoo

Edward Fuergut

Martin Gruber

Horst Groeninger

Philipp Seng

Peter Eibl

An electronic module includes a semiconductor package, and a clip connected to the semiconductor package. The clip is connected to or includes at least one fastening element which is configured to make a connection to an external heat sink.

Electronic module comprising a semiconductor package with integrated clip and fastening element

A method of manufacturing a package includes mounting an electronic component on an electrically conductive carrier, encapsulating part of the carrier and the electronic component by an encapsulant, covering an exposed surface portion of the carrier with an electrically insulating and thermally conductive interface structure, and covering at least part of the interface structure by a protection cap.

Protector cap for package with thermal interface material

A package includes an electrically conductive carrier, an electronic component on the carrier, an encapsulant encapsulating part of the carrier and the electronic component, an electrically insulating and thermally conductive interface structure covering an exposed surface portion of the carrier, and a protection cap covering at least part of the interface structure. Corresponding methods of manufacturing and operating the package are also described.

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Penang, Malaysia

Christian Kasztelan