Intel Corporation

Christian Karl

Simon C Steely, Jr

Richard J Dischler

Timothy D Wig

Yunhui Chu

Benjamin Keen

William J Butera

David Bach

Derek M Conrow

Olivier Franza

Brian Leung

Charles Magnuson

Sergei Babokhov

Christopher Philip Mozak

James Alexander Mccall

Simon C Steely Jr

Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.

Layered super-reticle computing : architectures and methods

Systems, apparatuses and methods may provide for an electronic spine and one or more digital pages removably attached to the electronic spine, wherein the one or more digital pages include a first side with a first flexible display and a second side with a second flexible display. In one example, the system may further include a magnetic interface, wherein the digital page is removably attached to the electronic spine via the magnetic interface.

Smartbook system having a synergistic page, spine, edge extension and power design

Layered super-reticle computing: architectures and methods

Growing community of inventors

Hudson, MA, United States of America

Christian Karl