Kulicke and Soffa Investments, Inc.

Christian Hoffman

David T Beatson

James E Eder

John Ditri

Lawrence B Brown

Jonn Ditri

Michael Woodward

A method and system for providing different images representing plural depths of field of an electronic device. The vision system has a beamsplitter for receiving an image of the device illuminated by the at least one light source, the beamsplitter providing one of the plurality of images of the device based in a wavelength of the light source; an aperture having a plurality of effective diameters based on the wavelength of light from the at least one light source, the aperture determining a depth of field of the image of the device; and an optical element for receiving the image of the device, the optical element magnifying the image by a predetermined magnification factor to produce a magnified image having the determined depth of field.

Method for providing plural magnified images

Multi-wavelength aperture and vision system and method using same

A system and method having applications in semiconductor areas for accurate die placement on a substrate that takes into account any positional offset from the reference position due to variations caused by thermal change and other nonrandom systemic effects. The system includes an offset alignment tool having a plurality of internal reflection surfaces and located below a vision plane of the substrate, and an optical detector to receive an indirect image of a bottom surface of the die through the alignment tool, such that the die is accurately positioned on the substrate based on the indirect image received by the optical detector. The method comprises the steps of providing a cornercube offset alignment tool having a plurality of total internal reflection surfaces below a vision plane of the die, and receiving an indirect image of the die tool through the cornercube offset tool.

Die attach process using cornercube offset tool

A method and system for providing different magnified images of an electronic device. The vision system has a first beamsplitter for receiving an image of the device illuminated by a light source, the beamsplitter providing multiple of images of the device; optical elements for receiving the plural images of the device, each of the optical elements magnifying the image by a predetermined magnification factor to produce more than one magnified images; and a second beamsplitter for receiving the magnified images and filtering out all but one of the magnified images based on a wavelength of the light source.

Multi-color machine vision system

A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.

Indirect imaging method for a bonding tool

Die attach system and process using cornercube offset tool

Indirect imaging system for a bonding tool

Cornercube offset tool

Growing community of inventors

Willow Grove, PA, United States of America

Christian Hoffman