Luminus Devices, Inc.

Enablence Holdings LLC

Rambus International Ltd.

Christian Hoepfner

Paul Joseph Panaccione

Georgia Chmielewski

Robert F Karlicek, Jr

John W Graff

Daniel Mendoza

Michael Denninger

Alexei A Erchak

Elefterios Lidorikis

Michael Hong Lim

Desmond Rodney Lim

Kevin Kidoo Lee

Jo A Venezia

Wang-Yuhl Oh

David Paul Doyle

Gianni Taraschi

Michael A Joffe

Boumy Sayavong

Illumination assemblies, components, and related methods are described. An illumination assembly is provided that comprises a plurality of illumination tiles each having a light emission surface. The plurality of illumination tiles are arranged in a two-dimensional array. The illumination tiles are constructed and arranged so as to provide a substantially contiguous illumination surface comprising the light emission surfaces of the plurality of the illumination tiles. Each illumination tile is illuminated by at least one solid state light-emitting device. A method of local dimming an illumination assembly of a display (e.g., LCD) backlight unit is also provided.

Tiled illumination assembly and related methods

LED package

Connector for LED package

Light-emitting devices, and related components, processes, systems and methods are disclosed.

Packaging designs for LEDs

A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. The optical chip having a waveguide having an axis. A portion of the waveguide is removed to form the access point such that light exiting the planar optical waveguide is directed in a direction substantially different from the axis of the waveguide. An optical probe is placed along a propagation path of the exiting light to optically couple the optical probe and optical chip.

Method and apparatus for on-wafer testing of an individual optical chip

A method for testing an optical chip, while the optical chip is still on a wafer, utilizing an optical probe, includes the steps of creating an access point on the wafer adjacent the optical chip. Inserting a probe at the access point to optically couple the optical probe and optical chip. The optical probe includes at least a first optical waveguide for changing the direction of input light at the probe to optically couple with the optical chip at the access point.

Growing community of inventors

North Andover, MA, United States of America

Christian Hoepfner