At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Christian Galler

Gerhard Stubenberger

Markus Leitgeb

Mike Morianz

Wolfgang Schrittwieser

A method of manufacturing a component carrier is presented. The method includes providing a base structure having a front side and a back side, the back side being at least partially covered by a metallic layer, removing material of the base structure from the front side to thereby form a cavity which is at least partially closed by the metallic layer, inserting a component in the cavity and placing the component on the metallic layer.

Metallic layer as carrier for component embedded in cavity of component carrier

An electronic device includes a component carrier with a component carrier body, an electrically conductive layer, and an adhesive structure. The electronic device further includes an electronic component which is arranged within the component carrier body. The adhesive structure is formed between a surface of the electronic component and the electrically conductive layer and covers only a part of the surface of the electronic component. A remaining part of the surface of the electronic component is covered with the component carrier body.

Growing community of inventors

Leoben, Austria

Christian Galler