Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Koninklijke Philips Corporation N.v.

Infineon Technologies Ag

Koninklijke Philips Electronics N.v.

Christian Drabe

Harald Schenk

Thomas Klose

Thilo Sandner

Alexander Wolter

Denis Jung

Gereon Vogtmeier

Roger Steadman

Ralf Dorscheid

Bert Kaiser

Anke Krasemann

Sergiu Langa

Bruno Spuler

Thomas Morgenstern

Andreas Bergmann

Jana Haensel

Barbara Lorenz

Torsten Schneider

André Dreyhaupt

A micromechanical apparatus includes a substrate, a movable element disposed in a reference plane in an undeflected state, a transmission structure having a first transmission side coupled to the substrate, and a second transmission side coupled to the movable element, and an actuator configured to provide a force along a force direction parallel to the reference plane and apply the same to the first transmission side. The transmission structure is configured to transfer the force along the force direction to a movement of the movable element out of the reference plane.

Micromechanical structure, micromechanical system and method of providing a micromechanical structure

A micromechanical structure has a first micromechanical element, a second micromechanical element and a torsion spring arrangement having a first torsion spring element, having a first center line, mechanically connected to the first micromechanical element at a first contact region and to the second micromechanical element at a second contact region, and having a second torsion spring element, having a second center line, mechanically connected to the first micromechanical member at a third contact region and to the second micromechanical member at a fourth contact region in order to connect the first micromechanical member and the second micromechanical member to be movable relative to each other. A distance between the first and second center lines, starting from the first and third contact regions toward the second and fourth contact regions, decreases in a first portion and increases in a second portion. In a rest position of the micromechanical structure, the first and second torsion spring elements are arranged without contact to each other.

Micromechanical structure and method of providing the same

A production methods includes providing a substrate including a lattice plane that extends in a non-symmetrical manner and such that it is offset at an angle &#x3b1; from at least a first or second main surface region of the substrate, the first and second main surface regions extending parallel to each other; anisotropic etching, starting from the first main surface region, into the substrate so as to obtain an etching structure which includes, in a plane extending perpendicularly to the first main surface region, two different etching angles relative to the first main surface region; arranging a cover layer on the first main surface region, so that the cover layer lies against the etching structure in at least some sections; and removing, section-by-section, the material of the substrate starting from the second main surface region in the area of the deformed cover layer, so that the cover layer is exposed in at least one window region.

Production method

The invention relates to the torsion springs for micromechanical applications. They can be used if elements are to be pivoted about an axis in an oscillating fashion. According to the object which is set, the torsion springs are to have an improved linear spring characteristic. The torsion springs according to the invention have a square, rectangular or trapezoidal cross section. A slot which is oriented orthogonally with respect to the longitudinal axis of the torsion spring and another slot which is formed in the torsion spring along its longitudinal axis and which opens into the first slot are formed at a clamping end point.

Torsion spring for micromechanical applications

The invention relates to semiconductor substrates and methods for producing such semiconductor substrates. In this connection, it is the object of the invention to provide semiconductor substrates which can be produced more cost-effectively and with which a high arrangement density as well as good electrical conductivity and closed surfaces can be achieved. In accordance with the invention, an electrically conductive connection is guided from its front side through the substrate up to the rear side. The electrically conductive connection is completely surrounded from the outside. The insulator is formed by an opening which is filled with material. The inner wall is provided with a dielectric coating and/or filled with an electrically insulating or conductive material. The electrically conductive connection is formed with a further opening which is filled with an electrically conductive material and is arranged in the interior of the insulator. The openings are formed with step-free inner walls aligned orthogonally to the front side or tapering continuously in the direction of the rear side.

Semiconductor substrate and methods for the production thereof

Method for structuring a device layer of a substrate, wherein the substrate includes a carrier layer, the device layer and an intermediate layer disposed between the carrier layer and the device layer. Thereby, the intermediate layer is structured for exposing, at least in one portion, a first surface of the carrier layer facing the device layer. Starting from a second surface of the carrier layer opposing the first surface, the thickness of the device layer is reduced to a predetermined thickness at those positions where the intermediate layer is removed.

Method for structuring a device layer of a substrate

In a method for manufacturing a micromechanical structure, first a two-dimensional structure is formed in a substrate. The two-dimensional structure is deflected from the substrate plane by action of force and fixed in the deflected state.

Method for generating a micromechanical structure

The invention relates to micromechanical elements deflectable in an oscillating manner and to a method for the operation of such elements. In this respect, it is the object of the invention to be able to operate the micromechanical elements in a stable and simple manner on the oscillating deflection while taking account of the respective mechanical resonant frequency. A least one spring element is present on elements in accordance with the invention with which it is held. It is deflected between two reversal points using an electrical AC voltage. The one or more spring element(s) has/have non-linear spring characteristics so that a changed mechanical resonant frequency results in dependence on the respective deflection.

Oscillating, deflectable micromechanical element and method for use thereof

A deflectable structure includes a layer having a first area and a second area, a trench structure in the layer which penetrates the layer and separates the first area from the second area, a first junction between the first area and the second area, and a second junction between the first area and the second area, the first area being permanently moveable from a first, permanent position with regard to the second area to a second position, deflected as compared to the first position, with regard to the second area by applying a force.

Deflectable structure, micromechanical structure comprising same, and method for adjusting a micromechanical structure

A micromechanical device includes a micromechanical functional structure, which can be deflected about a main axis from a rest position, a movable electrode, which is mounted to the micromechanical functional structure, and a fixed electrode, which can be tilted about a tilting axis with respect to the movable electrode in the rest position, wherein the tilting axis is parallel to the main axis or is identical with the main axis.

Micromechanical device with tilted electrodes

The invention relates to a micro-optical arrangement with which in particular optical properties of an optical element or its influencing of electromagnetic radiation may be changed. Thereby the optical elements with a reflecting surface are preferred. It is the object of the invention to provide for a changeability of optical parameters, in particular of the focal width with small time constants, in an inexpensive manner and with a small required constructional volume. The micro-optical arrangement according to the invention comprises a plate-like optical element onto which electromagnetic radiation is directed on an optically effective surface. The optical element thereby is fixed or clamped at least at one outer edge point. The optical element is elastically deformed due to mass inertia as a result of a translatory movement at least approximately parallel to the optical axis between two reversal points (&#x2212;z, z).

Micro-optical arrangement

An acceleration sensor comprises a mass, which can be deflected in a first direction and a second direction opposite to the first direction, a driver effective to vibrate the mass, a detector for detecting times when the mass passes a predetermined position when an acceleration is applied, and an evaluator which detects the acceleration based on the detected times during acceleration and times when the mass passes the predetermined position when no acceleration is applied. Thereby, it is achieved that the acceleration is detected inexpensively and accurately.

Acceleration sensor and method for detecting an acceleration

A two-step etch process is used to form a vertical collar oxide within the upper portion of a trench capacitor. The first step uses CF/SiF/Ochemistry and ends when the bottom of the collar within the trench is opened although a thin oxide layer still remains on the surface of the PAD-nitride. The second etch step uses CFchemistry to completely remove the remaining silicon oxide layer. The process provides a good uniformity in thickness of the PAD-nitride layer and sufficient collar oxide thickness in the very top section of the collar oxide. The process is applicable for manufacturing deep trench capacitors for DRAM devices.

Growing community of inventors

Dresden, Germany

Christian Drabe