Silicon Graphics, Incorporated

Vocera Communications, Inc.

Chris Wheaton

Robert E Shostak

Arun Mirchandani

Ben Chia

William A Rains

Debashis Pramanik

Wireless communications device

A microphone enclosure for reducing the intensity of sound waves that reach a microphone is presented. The enclosure may be a solid mass with a cavity, designed so that most of the microphone is surrounded by the solid mass when the microphone is inserted into the cavity. The solid mass is dense enough to reduce much of the sound waves that are first mechanically and then acoustically coupled with the microphone. The microphone may be inserted into the cavity so that a sound receiving section is exposed at the entrance of the cavity. Also, the microphone may not be inserted to the end of the cavity so that there is a space between the end of the cavity and the microphone. A hole may be located on the cavity sidewall so that sound can reach the microphone through this space. The sound receiving sections of the microphone are aligned with openings in the communications device.

Microphone enclosure for reducing acoustical interference

The present invention is drawn to a system and a method for attaching and tightening a mechanism onto an IC package such that a load-balanced thermal contact is formed securely between the mechanism and the IC package without risking damages to the IC package. The mechanism is then used to support a heat sink that utilizes the thermal contact formed for dissipating heat away from the IC package. Specifically, the mechanism is modified in stages. During the tightening stage, the mechanism is modified from a first configuration into a second configuration in order to trigger the process of tightening the mechanism securely onto the IC package. More specifically, in its first configuration during the attaching stage, the mechanism includes a spring compressed within a first spacing formed by a bearing plate and a compression screw. Then, the mechanism is modified into the second configuration by the removal of the compression screw, wherein the same spring is compressed at a second spacing formed by the bearing plate and a terminating plate, and wherein the second spacing is longer than the first space as to allow the spring to lengthen to a desired length. As the spring lengthens to its desired length, it pulls the heat sink support towards the IC package and pushes the IC package towards the heat sink support. In so doing, a load-balanced and efficient thermal contact is formed securely between the mechanism and the IC package without risking damages to the IC package.

Metered force single point heatsink attach mechanism

A EMI shield which includes a heat sink and a compression coupling. A top housing formed of electrically conductive material is placed over a circuit board containing electronic devices and is electrically coupled to an electrical ground through contact along the length of a conductive strip which is connected to an electrical ground. A bottom housing formed of electrically conductive material is connected to an electrical ground through electrical contact along the length of a conductive strip located on the bottom of the circuit board so as to form a EMI shielding enclosure. The top housing is formed of thermally conductive material and includes extended surfaces for conducting heat away from the electronic devices contained below the top housing. In addition, the bottom housing is formed of thermally conductive material so as to form a thermally conductive enclosure which acts as a heat sink, effectively cooling the electronic devices contained therewithin. A compression coupling mechanism which uses springs to press the top housing towards the bottom housing gives consistent electrical contact between a microprocessor and a circuit board.

Electromagnetic interference shielding enclosure and heat sink with

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San Francisco, CA, United States of America

Chris Wheaton