General Electric Company

Anello Photonics, Inc.

Measurement Specialties, Incorporated

Silicon Microstructures, Inc.

Chris Wagner

Mario J Paniccia

Mike Horton

Brian Allen Engle

Dale Alan Gee

Gertjan Van Sprakelaar

Derek Hubert McReavy

Keyanoush Razavidinani

Matthew Ingco

The present disclosure relates to integration of integrated photonics-based optical gyroscopes and fiber-based optical gyroscopes into portable apparatuses that may include compass features. Novel small-footprint modularized fully integrated photonics optical gyroscopes are used for non-critical axes. However, for at least one critical axis, a fiber-optic gyroscope can be used to provide bias stability below 0.1°/Hr, which is directly correlated to predicting positional accuracy in the centimeter range. The positional accuracy results from the compassing ability of the gyroscope (referred to as gyrocompass) to calculate direction of heading using the earth's rotation.

Portable optical gyroscope and compass unit

Pressure sensor systems that include a pressure sensor die and other components in a small, space-efficient package, where the package allow gas or liquid to reach either or both sides of a membranes of the pressure sensor die. A package can include a substrate and a cap, where either or both the substrate and the cap divide the package internally into two chambers. The substrate can have a solid bottom layer, a middle layer having a slot or path running a portion of the length of the layer, and a top layer having two through-holes that provide access to the slot or path. The cap can have two ports. A first port can lead to a first chamber where a top side of a pressure sensor is in the first chamber. A second port can lead to a second chamber and the slot or path, where the slot or path leads to a bottom side of the pressure sensor.

Leadless pressure sensor

Pressure sensor systems and methods of assembling pressure sensor systems that reduce the need for accurate placement of a pressure sensor die in a pressure sensor package, reduce leakage in pressure sensor systems, and provides a consistent attachment of a pressure sensor die to a package.

Pressure sensor die attach

A pressure sensor assembly is disclosed wherein the substrate to which the pressure sensing die is mounted is decoupled from the package.

Pressure sensor assembly

There are provided embodiments of a sensing device that comprise a sensing element, a substrate, and a bonding element, each being selected for environments that utilize caustic working fluids such as automotive fuel. Material for use as the bonding element can form molecular bonds with ceramics and glass. In one embodiment, the sensing device comprises a receptacle or cavity, in which are located the sensing element and the bonding element. This configuration facilitates the formation of bonds between the bonding element and each of the sensing element and a peripheral wall of the cavity. Such bonds are configured in a tensile bonding area and a shear bonding area, the combination of which is useful to secure the sensing element in the cavity. The sensing device can further comprise a seal such as an o-ring disposed in annular relation to the substrate to seal the sensing device to a peripheral device such as a fluid fitting, which may be found in a fuel system of an automobile.

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San Jose, CA, United States of America

Chris Wagner