Koninklijke Philips Corporation N.v.

Analogic Corporation

Chris Vrettos

Marc Anthony Chappo

Rodney Arnold Mattson

Randall Peter Luhta

Randy Luhta

Brian E Harwood

Ruvin Deych

Daniel Abenaim

Martin Choquette

Anthony F Krecic

Among other things, a detector unit for a radiation detector array is provided. The detector unit includes a radiation detection sub-assembly including a scintillator and a photodetector array. A first routing layer is coupled to the photodetector array of the radiation detection sub-assembly at a first surface of the routing layer. An electronics assembly includes an analog-to-digital converter that converts an analog signal to a digital signal. A second routing layer is disposed between the A/D converter and the first routing layer. A shielding element is disposed between the A/D converter and the second routing layer. The shielding element shields the A/D converter from the radiation photons. The second routing layer couples the electronics sub-assembly to the first routing layer. A first coupling element couples the A/D converter to the second routing layer.

Detector unit for detector array of radiation imaging modality

Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.

An imaging apparatus () includes a detector array () with at least one detector tile (). The detector tile includes a photosensor array () with a two dimensional array of individual photosensitive detector pixels () located within a non-photosensitive area () and readout electronics () coupled to the photosensor array. The readout electronics includes individual analog readout channel wells () corresponding to the individual detector pixels, wherein an analog readout channel well electrically isolates analog electrical components therein from analog electrical components in other analog readout channel wells. Decoupling circuitry optionally is located in at least one of metal layers of the individual analog readout channels or in the individual analog readout channel wells.

Imaging detector with per pixel analog channel well isolation with decoupling

A radiation detector module () particularly well suited for use in computed tomography (CT) applications includes a scintillator (), a photodetector array (), and signal processing electronics (). The photodetector array () includes a semiconductor substrate () having a plurality of photodetectors and metalization () fabricated on non-illuminated side of the substrate (). The metalization routes electrical signals between the photodetectors and the signal processing electronics () and between the signal processing electronics () and an electrical connector ().

Radiation detector array

An imaging system () includes a radiation source () that emits radiation that traverses an examination region () and a detection system () that detects radiation that traverses the examination region () and generates a signal indicative thereof. The detection system () includes a first detector array (-) and a second detector array (-). The first and second detector arrays (-) are separately distinct detector arrays and at least one of the detector arrays (-) is moveable with respect to the radiation beam. A reconstructor () reconstructs the signal and generates volumetric image data indicative thereof.

Multi-detector array imaging system

A radiographic imaging apparatus () comprises a primary radiation source () which projects a beam of radiation into an examination region (). A detector () converts detected radiation passing through the examination region () into electrical detector signals representative of the detected radiation. The detector () has at least one temporally changing characteristic such as an offset B(t) or gain A(t). A grid pulse means () turns the primary radiation source () ON and OFF at a rate between 1000 and 5000 pulses per second, such that at least the offset B(t) is re-measured between 1000 and 5000 times per second and corrected a plurality of times during generation of the detector signals. The gain A(t) is measured by pulsing a second pulsed source () of a constant intensity (XRef) with a second pulse means (). The gain A(t) is re-measured and corrected a plurality of times per second during generation of the detector signals.

Pulsed x-ray for continuous detector correction

A computerized tomographic imaging system including a stationary gantry portion defining an examination region and a rotating gantry portion for rotation about the examination region. An x-ray source is disposed on the rotating gantry portion for projecting x-rays through the examination region. A plurality of modular radiation detector units are disposed across the examination region from the x-ray source. Each radiation detector unit includes an array of x-ray sensitive cells for receiving radiation from the x-ray source after it has passed through the examination region and for generating an analog signal indicative of the radiation received thereby. Each radiation detector unit also includes a plurality of integrated circuits connected to the x-ray sensitive cells with each integrated circuit including a plurality of channels. Each channel receives the analog signal from an x-ray sensitive cell and generates digital data indicative of the value of the analog signal.

Data acquisition for computed tomography

A CT scanner ( ) includes a reconstruction processor ( ) for reconstructing an image from digital signals from detector arrays ( ). Each detector array includes scintillation crystals ( ) arranged in an array for converting x-ray radiation into light. An array of back-illuminated photo diodes ( ) is mounted beneath the scintillation crystal array for converting the light emitted from the scintillation crystals into electrical charge. The electrical charge from the back-illuminated photodiodes is transmitted via a path orthogonal to the detector array ( ) to signal processing circuitry ( ). The back-illuminated photodiode has a backside ( ) which is in optical communication with the crystal array ( ) and which is optically transmissive to photons of light emanating from the crystal. The converted electrical charge leaves the photodiode via electrical connections ( ) or bump bonds ( ) on the front side of the photodiode. This arrangement allows a plurality of paths ( ) through the substrate ( ) supporting the photodiode to provide electrical connectivity ( ) from the array to processing circuitry ( ), reducing or eliminating the bottleneck of electrical leads from conventional arrays.

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Willoughby, OH, United States of America

Chris Vrettos