Finisar Corporation

Cisco Technology, Inc.

Marvell Asia Pte., Ltd.

Vivid Medical, Inc.

Inphi Corporation

Hewlett-packard Company

Chris Togami

Gary D Sasser

Frank J Flens

Tat Ming Teo

Radhakrishnan L Nagarajan

Paul Kessler Rosenberg

Mina Farr

Brian Taylor

Guy Newhouse

Donald Arthur Ice

Ravinder Kachru

Kai F Ng

Lewis B Aronson

Kishor V Desai

James Edward Stewart

Darin James Douma

Andy Engel

Masaki Kato

Andreas G Weber

Rudolf J Hofmeister

Joshua Moore

Franklin J Wall, Jr

Stephen Charles Gordy

Stephan C Burdick

Ali Farr

Vipulkumar K Patel

Kalpendu Shastri

Frank H Levinson

Soham Pathak

Jan Lipson

Ramesh Sundaram

Greta Light

Bipin Dama

Peng-Chih Li

Stefan Pfnuer

The-Linh Nguyen

Joshua John Edward Moore

Jinxiang Liu

David Allouche

Pang-Chen Sun

Linda Liu

John Christian Moller

Axel Mehnert

Hermando Esguerra

Tom Downey

Peter E Campbell

Laleh Farr

Richard Ruh

Shane James Kenney

Pei-Keng Fu

Heat sink cover

An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

Pluggable photonic transceiver and cooling modules including external heat sink assemblies and corresponding network system

Apparatus and method for thermal dissipation of photonic transceiving module

An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.

Electromagnetic radiation shielding on a PCI express card

A device for display of medical vision images and video may include a portable display screen and housing. The device may also include a mounting mechanism located on the back of the housing. The mounting mechanism may be configured to removably engage a complementary mounting mechanism on a structure for removably mounting the portable display screen and housing to the structure. The device may also include means for communicatively coupling the portable display screen to one or more optoelectronic vision and illumination modules for control and processing of information.

Control and display device

An optical device may include an optical bench used align a photonic chip to a receptacle. In one embodiment, a surface of the optical bench defines an alignment plane. When a fiber stub in the receptacle is disposed on the surface, an optical path in the stub is parallel with the alignment plane. By disposing the photonic chip on the same surface, the chip and the stub can be aligned such that optical signals can be transmitted between the stub and an optical component (e.g., light source or waveguide) in the photonic chip. In one embodiment, the optical path in the stub and the optical component may have the same height relative to the optical bench. Moreover, the optical device may include a direct thermal connection between the assembly and the heat sink, and thus, have better thermal coupling relative to using thermal pads.

Optical bench for aligning an optical device

An apparatus for handling a fiber-array to be attached with a silicon-photonics chip. The apparatus includes a bottom-plate having a first trench formed with two first branches connected to two first recessed regions at a first end and one second branch straight to a second end thereof and a second trench sharing the same second branch and having two third branches connected to two second recessed regions with an angle towards two sides outside the two first branches. The bottom-plate includes many female clip structures located at the first end, the second end, and the two sides. The apparatus includes a top-plate having corresponding male clip structures configured to lock with the female clip structures to at least have two shaped cavities at the first end for firmly holding fiber ferrules of the fiber-array substantially without lateral and axial motion while leaving excess lengths of fibers outside the second end.

Fiber tray apparatus and method for handling a fiber-array/silicon-photonics-die assembly

An apparatus for packaging a photonic transceiver. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB installed inside the spatial volume over the base member with a pluggable connector at the back end. The apparatus includes one or more optical transmitting devices being mounted upside-down via a flex circuit board bended 180 degrees inward to a backside of the PCB and including a built-in TEC module in contact with the lid member. Furthermore, the apparatus includes a silicon photonics chip including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance-amplifier module. Moreover, the apparatus includes an optical input port and output port being back connected to the fiber-to-silicon attachment module.

Photonic transceiving device package structure

Techniques for coupling light from a waveguide array to a single mode fiber array are described. In an embodiment, lateral misalignment of an array of focusing lenses and an array of optical fiber ferrules held into alignment by a lens holder sub-assembly is compensated by tilting the lens holder sub-assembly with respect to the propagation axis of the light being coupled by the lens holder-subassembly. Since the amount of tilt can be adjusted according to the degree of lateral misalignment, lens holder sub-assemblies manufactured with varying degrees of misalignment may be utilized to couple light into single mode fiber-optic cable. In addition, the same technique can also be used to compensate for other defects as well, such as angular errors in manufacturing or placement of a turning mirror or prism used to direct light into the lens holder sub-assembly.

Coupling light from a waveguide array to single mode fiber array

Embodiments disclosed herein generally relate to an optical device for transferring light between a first and second waveguide. The optical device may generally include the first waveguide, a first support member and a base on which the first waveguide and first support member are disposed. The optical device may further include a second support member wherein the first support member is disposed between the second support member and the base. The second support member comprises at least one groove. The second waveguide may be disposed at least partially in the groove such that the second waveguide is between the first and second support members. The optical device may further include at least one lens disposed between the first waveguide and the second waveguide to transfer an optical signal between the first and second waveguides through the lens.

Optically coupling waveguides

An apparatus for providing single mode optical signal coupling between an opto-electronic transceiver and a single mode optical fiber array takes the form of a lens array and a ferrule component. The lens array includes a plurality of separate lens element disposed to intercept a like plurality of single mode optical output signal from the opto-electronic transceiver and provide as an output a focused version thereof. The ferrule component includes a plurality of single mode fiber stubs that are passively aligned with the lens array and support the transmission of the focused, single mode optical output signals towards the associated single mode optical fiber array.

Single mode fiber array connector for opto-electronic transceivers

An example embodiment includes a communication module. The communication module includes a shell, a printed circuit board assembly ('PCBA') at least partially positioned within the shell, an optical transmitter electrically coupled to the PCBA, an optical receiver electrically coupled to the PCBA, and a biasing assembly. The biasing assembly includes a latch cover configured to be attached to the shell, a slider, and a spring. The slider is configured to operate a latching mechanism that releasably connects the module to a host device through a mechanical connection. The slider includes a main body including a first end, an arm extending from the first end, and a stopper feature extending from the arm. The spring is positioned between the latch cover and the stopper feature to bias the latching mechanism.

Biasing assembly for a latching mechanism

Growing community of inventors

San Jose, CA, United States of America

Chris Togami