Amazon Technologies, Inc.

Chris T Li

David C Buuck

Steven Chase

Amish Rajesh Babu

Ximeng Simon Yang

Shyeu-Yang Wang

Christopher Paul Lander

Components within a portable device are arranged around a perimeter of a display component to reduce the height of the portable device. Components such as a battery, a main logic board, a wireless networking interface, and so forth may be distributed around a display component such as an electrophoretic display. Distribution of components around the perimeter of the display component rather than behind the display component reduces the height. Furthermore, the placement of components in the perimeter provides a structure for a user to grip the portable device or for placement of user actuable controls.

Height reduction in portable devices

One or more data signal interconnects arranged on a substrate of a dense array reduce overall size of a device incorporating the dense array, such as a touch sensor or display. The data signal interconnects on the substrate carry signals from printed circuits coupled to the array to a controller via interconnect tabs.

Substrate interconnect routing

Disclosed is a clip is for routing and grounding a coaxial cable on a printed circuit board. The clip may be mechanically and electrically engaged to the printed circuit board and may be comprised of a resilient and conductive material. The clip engages and retains the coaxial cable and establishes an electrical connection between the coaxial cable and the printed circuit board. A sheath may be placed around a portion of the coaxial cable to engage the clip.

Surface mount clip for routing and grounding cables

Disclosed is a clip configured to ground a receptacle, such as a micro universal serial bus (MUSB) receptacle, to a ground plane. The clip may comprise a pair of locating features extending from the front edge of the clip for alignment with an edge of a circuit board to which the receptacle is affixed, a spring tab on the top surface configured to contact the ground plane when the device is assembled, and engagement features on the left and right sides of the receptacle surface configured to engage the clip to the receptacle.

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Fremont, CA, United States of America

Chris T Li