Intel Corporation

Chris Rumer

Biswajit Sur

Sudipto Neogi

Boon Seng Tan

Sujit Sharan

Ashay A Dani

Tim A Renfro

Gudbjorg H Oskarsdottir

Chris Matayabas

Beverly J Canham

Edward Hurley

Rod Christner

A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert conditions and substantially without the use of a solder flux. Also described, is a heat dissipating device having a thermal interface material layer bonded thereto for thermal coupling to a heat conducting component by an impermanent attachment.

Metallic solder thermal interface material layer and application of the same

An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.

IC package pressure release apparatus and method

Windowed package for electronic circuitry

A silicon wafer has a plurality of integrated circuits terminated on a surface of the silicon wafer. The silicon wafer has a soluble protective coat on the surface of the silicon wafer. The coated silicon wafer may be processed by laser scribing. A solvent wash may be used to remove the soluble protective coat and debris from laser scribing. The coated silicon wafer may be saw cut after laser scribing. A flow of solvent may be provided during the saw cutting. The flow of solvent may be sufficient to remove at least a substantial portion of the soluble protective coat.

Silicon wafer with soluble protective coating

Growing community of inventors

Chandler, AZ, United States of America

Chris Rumer