Applied Materials, Inc.

Chris Pabelico

Xianmin Tang

Yu Lei

Roey Shaviv

Yi Xu

Tae Hong Ha

Sang-Hyeob Lee

Ismail T Emesh

Jin Hee Park

Apparatuses and methods to provide electronic devices having metal films are provided. Some embodiments of the disclosure utilize a metallic tungsten layer as a liner that is filled with a metal film comprising cobalt. The metallic tungsten layer has good adhesion to the cobalt leading to enhanced cobalt gap-fill performance.

Deposition of metal films with tungsten liner

Implementations of the disclosure may include methods of electroplating features formed on a semiconductor device, such as the trenches and vias formed by single or dual Damascene processes using a cobalt plating bath. The cobalt electroplating bath may contain 'additive packages' or 'additive systems' that include a combination of additives in certain ratios that facilitate the metal filling of high aspect ratio sub-micrometer features. Implementations of the disclosure provide new cobalt plating bath methods and chemistries and that include alkyl modified imidazoles, imidazolines, and imidazolidines suppressor compounds.

Enhanced plating bath and additive chemistries for cobalt plating

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San Jose, CA, United States of America

Chris Pabelico