Dell Products Inc.

Chris M Helberg

Travis Christian North

Austin Michael Shelnutt

Andrew Thomas Sultenfuss

Steven Embleton

Eric Michael Tunks

Philip Joseph Grossmann

Joohyun Woo

Edward Douglas Knapton

Kevin Brian Locke

Rene Jason Salas

Brian M Hahn

An apparatus may include an enclosure that includes a plurality of mounting features that are configured to receive information handling systems; one or more environmental sensors configured to determine environmental conditions associated with the enclosure; a position sensor configured to determine a geodetic location of the enclosure; a heater configured to heat the enclosure; and a heater control system. The heater control system may be configured to: receive information regarding an origin for the enclosure, a destination for the enclosure, and a desired destination temperature for the enclosure; establish a model for the enclosure, wherein the model incorporates data from the one or more environmental sensors and data from the position sensor; and based on the model, predictively determining control parameters for the heater configured to cause the enclosure to reach the desired destination temperature at or before a time of arrival at the destination.

Environmental management based on temporal and spatial predicitons

Modular heat sinks are provided that support configurations using combinations of cooling and expansion card components, whereby the expansion card may support coupled devices. Heat sinks may include a fin set that is permanently fixed to the heat sink and a second fin set that can be decoupled from a location on the heat sink base. The second fin set can instead be replaced on the heat sink base by an expansion card connector, such as a M.2 expansion card connector. In some embodiments, an expansion card connector also includes a fin set, with the expansion card connector fastened on top of that fin set. The fin set to which the expansion card connector is fastened may include multiple tiers of fins of different heights that may conform to the space available to the heat sink, thus maximize cooling capabilities of the heat sink while also supporting an expansion card.

Modular heat sink supporting expansion card connector

Performance of a system may be boosted with a boost dock that seals fan interfaces to improve airflow through an information handling system. An apparatus may include a first port configured to seal a first interface between the apparatus and an information handling system. The apparatus may also include a first blower configured to receive ambient air as cool intake air and to blow the cool intake air into the information handling system through the first interface sealed by the first port. The apparatus may further include a second blower configured to receive warm exhaust air from the information handling system through the first interface sealed by the first port and to blow the warm exhaust air out of the apparatus. A method may include steps of sealing a first interface, receiving ambient air, blowing cool intake air, receiving warm exhaust air, and blowing warm exhaust air.

Multi-fan sealed boost dock

A method for cooling components of an information handling system (IHS) includes detecting, via a thermal control system, at least one pressure reading, at least one temperature reading and at least one current cooling device setting of the IHS. At least one new cooling device setting is calculated based on the pressure reading and the temperature reading. The new cooling device setting is compared to the current cooling device setting associated with one or more cooling devices of the IHS. In response to the new cooling device setting being different from the current cooling device setting, one or more of the corresponding cooling devices are triggered to adjust its/their current cooling device setting to the new cooling device setting corresponding to the respective cooling device.

System and method for cooling an information handling system

An assembly for cooling a heat dissipating device reducing the thermal contact/interface resistance between a heatsink and a heat dissipating device includes: a heat dissipating device having a heat releasing surface; a heatsink having a heat absorbing surface; a gasket extending between the heat releasing surface and the heat absorbing surface to provide a sealed interstitial cavity; and a working fluid provided within the cavity. The working fluid has specific thermal properties that cause the fluid to (i) absorb latent heat and evaporate from a liquid to a vapor at the liquid surface in contact with the heat releasing surface during operation of the heat dissipating device and (ii) condense from the vapor back to the liquid when the vapor contacts the heat absorbing surface of the heatsink, thus releasing the latent heat from the vapor to the heatsink.

Liquid-vapor phase change thermal interface material

An information handling system (IHS) includes a base station that has a transmitter coil to generate a magnetic field for charging a portable power source of a battery-powered electronic device. A receiver coil magnetically receives power from the transmitter coil of the base station. A power control module connected to the portable power source and the receiver coil charges the portable power source with the received power. A flexible ferrite shield is positioned on a side of the receiver coil opposite to the transmitter coil to shield the IHS electronics. A pneumatic diaphragm is formed by a portion of the flexible ferrite shield that is positioned for oscillating movement into a center cavity of the receiver coil. A diaphragm actuator is attached to the pneumatic diagram and is responsive to a triggering signal to oscillate the pneumatic diaphragm to disperse thermal energy that is generated by the receiver coil.

Advanced convectively-cooled inductive charging

Control signals, such as PWM control signals, can be used to control aspects of a cooling system and can be generated using proportional-integral-derivative (PID) control. PID control systems for cooling systems are designed based on default environmental and system characteristics and pre-programmed for operation prior to delivery to customers or end users. Changes in environmental and system characteristics, such as component aging, environmental variations, and variation in manufacturing from system to system, such as heat sink effectiveness and application of thermal pastes, can impact system level performance of the control system. Adjusting gain parameters for the P, I, and D components of a PID control signal can reduce negative impact on system performance resulting from such changes and allow the control system to better adjust to external factors.

Active proportional-integral-derivative (PID) gain tuning for controlling a cooling system for an information handling system

Systems and methods for component population optimization are described. In some embodiments, an Information Handling System (IHS) may include a logic circuit and a memory coupled to the logic circuit, the memory having information stored thereon that, upon access by the logic circuit, enable the IHS to: identify a connector provided on a Printed Circuit Board (PCB), wherein the connector is configured to receive a device and to couple the device to a processor; and visually indicate a status of the connector.

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Austin, TX, United States of America

Chris M Helberg