Kla Tencor Corporation

Kla-tencor Technologies Corporation

Zygo Corporation

Chris Koliopoulos

Richard Earl Bills

Songping Gao

Bruce W Baran

Michael Murphree

Peter J De Groot

Leslie Ludwig Deck

Jaydeep K Sinha

James F Biegen

Matthew R Boston

Delvin A Lindley

John F Valley

Noel Poduje

An optical assembly for use in an interferometer is provided. The optical assembly includes first and second partially reflective surfaces positioned along an optical axis and oriented at different non-normal angles to the optical axis. The second partially reflective surface is configured to receive light transmitted through the first partially reflective surface along the optical path, transmit a portion of the received light to a test object to define measurement light for the interferometer and reflect another portion of the received light back towards the first partially reflective surface to define reference light for the interferometer. The reference light makes at least one round trip path between the second and first partially reflective surfaces.

Equal-path interferometer

A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The system features a variable scan speed beam scanning subsystem, preferably using an acousto-optic deflector, with beam compensation, so that variable scanning speeds can be achieved. Also included are methods and systems for improving the signal to noise ratio by use of scatter reducing complements, and a system and method for selectively and repeatedly scanning a region of interest on the surface in order to provide additional observations of the region of interest.

System and method for controlling a beam source in a workpiece surface inspection system

A platform is designed to support thin flat substrates, such as semiconductor wafers, during observation of characteristics of the substrates. The platform includes a rigid base having a top surface. A resilient pad is supported on the base and the pad has a top surface, at least a portion of which yieldingly supports a flat substrate placed thereon.

Compliant pad wafer chuck

A method and software is disclosed for evaluating characteristics, such as flatness, of a surface of a sample having an edge, comprising selecting an evaluation area having an area surface and a boundary, at least one portion of which is definable with reference to the edge, and evaluating characteristics of the area surface. Edge-specific evaluation conditions are used with edge-specific metrics to quantify parameters for said evaluation area. A system for evaluating such characteristics comprises a data collection system for generating data values for selected locations on said surface; and a data analyzing system for analyzing data values to determine such characteristics. A data interpolation system may be provided to interpolate data values collected with reference to a first coordinate system for analyzing with reference to a second coordinate system.

Method, system, and software for evaluating characteristics of a surface with reference to its edge

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Tucson, AZ, United States of America

Chris Koliopoulos