General Dynamics Advanced Information Systems, Inc.

General Dynamics Information Systems, Inc.

Chris H Simon

Deepak Keshav Pai

Ronald R Denny

Joan E Zak

The invention comprises methods for filling holes in printed wiring boards and printed wiring boards produced by these methods. The methods involve plating metal conductors inside the holes of the printed wiring boards while protecting the conducting surfaces of the printed wiring boards from being plated using photoresist film. The side surfaces of a printed wiring board are covered with photoresist. The photoresist is exposed to developing light, except the photoresist covering the holes on one side of the board is masked to prevent exposure of the holes to the developing light. The undeveloped photoresist covering the holes is removed. The board is subjected to a plating process, which deposits conductive materials in the holes, but the photoresist on the conducting surfaces of the board prevents conductive materials to be plated on the surfaces of the board.

Methods for filling holes in printed wiring boards

An apparatus and method for adjusting the clock delay in systems with multiple integrated circuits has a controller, a programmable clock generator and a plurality of integrated circuits, each integrated circuit including a data flip-flop, a programmable delay and a clock-fanout tree, wherein the clock delay in the integrated circuits is adjusted to match the inherent delay in the integrated circuit having the longest inherent delay.

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Minneapolis, MN, United States of America

Chris H Simon