Texas Instruments Corporation

Chris Edward Haga

Anthony Louis Coyle

William David Boyd

Leland Scott Swanson

In a method and system for fabricating a thermally enhanced semiconductor device () is packaged as a through hole single inline package (SIP). A leadframe () having a die pad () to attach an IC die (), a first plurality of conductive leads () formed from a first portion of metal sheet (), and a second portion of metal sheet () disposed on an opposite side of the IC die () as the first plurality of conductive leads is stamped from a metal sheet. The first plurality of conductive leads () are arranged in a single line and are capable of being through hole mounted in accordance with the SIP. The second portion of metal sheet () includes the die pad () to form a heat spreader () in the form of the metal sheet. The heat spreader () provides heat dissipating for the heat generated by the IC die ().

Thermally enhanced single inline package (SIP)

The invention provides thermally enhanced BGAs and methods for their fabrication with a ground ring suitable for operably coupling to either the frontside or backside, or both, of an IC chip mounted on a substrate. The methods and devices of the invention disclosed include the fabrication of a ground ring on the surface of a BGA substrate prepared for receiving the frontside of the chip. A heat spreader has ground ring corresponding to substrate round ring and is attached at the backside of the chip with a conductive material. A conductive material is interposed between the heat spreader and substrate ground rings, electrically coupling them. Thus, the backside of the chip may be electrically connected to the ground ring as well as, or instead of, the frontside.

Thermally enhanced BGA package with ground ring

A semiconductor device comprising a metallic leadframe () with a first surface () and a second surface (). The leadframe includes a chip pad () and a plurality of segments (); the chip pad is held by a plurality of straps (), wherein each strap has a groove (). A chip () is mounted on the chip pad and electrically connected to the segments. A heat spreader () is disposed on the first surface of the leadframe; the heat spreader has its central portion () spaced above the chip connections (), and also has positioning members () extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.

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McKinney, TX, United States of America

Chris Edward Haga