Texas Instruments Corporation

Chris D Atkinson

Richard L Guldi

Keith W Melcher

Shangting Detweiler

Basab Chatterjee

Kelly C Mollenkopf

In accordance with the invention, there are semiconductor devices and methods of making semiconductor devices and holes. The method of making a semiconductor device can comprise forming a photoresist layer over a surface of a wafer, wherein the wafer comprises an edge that has a substantially rounded profile, an array of dies, and at least one edge die. The method can also comprise dividing a shot area into a plurality of shot portions and assigning a blind ID to each of the plurality of shot portions. The method can further comprise identifying one or more edge shot portions on the edge of the wafer for additional exposure; and exposing one or more times identified one or more edge shot portions on the edge of the wafer and blocking non-identified one or more non-edge shot portions.

By-die-exposure for patterning of holes in edge die

A system and methods for the evaluation of the integrity of a wafer cassette and the disposition thereof are based upon evaluation of wafer measurement data obtained using a wafer sorter cassette mapping system utilized in-line during wafer sorting operations. In one embodiment, wafers are placed into slots in the wafer cassette. A wafer sorter cassette mapping sensor is scanned over the wafers in the wafer cassette. The positions of the wafers are measured while scanning the sensor over the wafers. The wafer position measurements are evaluated using a modeling system to determine slot positions, and a determination of the integrity of the cassette is generated. If the integrity determination indicates that the cassette is deformed beyond a predetermined value, the cassette is replaced. The measurement data may be stored in a data base for further trend analysis or for replacement forecasting.

Method and apparatus for cassette integrity testing using a wafer sorter

According to one embodiment of the present invention, a method of forming a semiconductor device includes forming a photoresist layer on a surface of a wafer. The wafer includes an array of die that includes a plurality of complete die and at least one partial edge die. The wafer has an edge that has a substantially rounded profile causing undersized patterns in semiconductor devices formed on partial edge die. A first exposure intensity is assigned to a first group of die on the surface of the wafer. The first group of die includes a group of complete die, and the first exposure intensity is assigned based at least in part on the location of the first group of die on the surface of the wafer. A second exposure intensity is assigned to a second group of die on the surface of the wafer. The second group of die includes at least one partial edge die. The second exposure intensity less than the first exposure intensity to compensate for reduced line width due to the wafer edge topography. Energy is directed at the second group of die at the second exposure intensity to avoid over-exposure of the second group of die.

System and method for exposure of partial edge die

A photolithography system includes a photolithography toolthat includes a stage upon which a semiconductor wafer is mounted. The tool is operable to move the stage to automatically focus a pre-determined image on a surface of the semiconductor wafer. The tool is further operable to log movements of the stage. The system also includes an automation host computeroperable to poll the photolithography toolto obtain data reflecting the logged movements of the stage. The automation host computeris further operable to analyze the data and compare the data to pre-determined error conditions. The host computer also takes a pre-determined action, including sending an electronic mail message to the personal computersof relevant line personnel, in the event the data meets the pre-determined error conditions.

Error reduction in semiconductor processes

A photolithography system includes a photolithography tool that includes a stage upon which a semiconductor wafer is mounted. The tool is operable to move the stage to automatically focus a pre-determined image on a surface of the semiconductor wafer. The tool is further operable to log movements of the stage. The system also includes an automation host computer operable to poll the photolithography tool to obtain data reflecting the logged movements of the stage. The automation host computer is further operable to analyze the data and compare the data to pre-determined error conditions. The host computer also takes a pre-determined action, including sending an electronic mail message to the personal computers of relevant line personnel, in the event the data meets the pre-determined error conditions.

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Lewisville, TX, United States of America

Chris D Atkinson