International Business Machines Corporation

Chrirag S Patel

Bing Dang

Paul Stephen Andry

Russell Alan Budd

Benjamin V Fasano

Paul Francis Fortier

David Hirsch Danovitch

Luc Gilbert Guerin

Sylvain E Ouimet

Frank F Libsch

An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with wiring. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. A plurality of OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the OE elements positioned in optical alignment with the optical via for receiving the light. A carrier is interposed between electrical interconnect elements. The carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board.

Silicon carrier optoelectronic packaging

Growing community of inventors

Yorktown Heights, NY, United States of America

Chrirag S Patel