United Microelectronics Corp.

Chow Yee Lim

Hong Liao

Chao Jiang

Hao Su

Lanxiang Wang

Chih-Chien Chang

Hui Ying Yang

Jianjun Yang

Hock Chun Chin

Zhi Qiang Mu

Yong Bin Fan

A manufacturing method of a semiconductor structure includes the following steps. A first polysilicon layer is formed on a substrate. A planarization process to the first polysilicon layer is performed. A first etching back process to the first polysilicon layer is performed after the planarization process. A second etching back process to the first polysilicon layer is performed after the first etching back process. A first wet clean process to the first polysilicon layer is performed after the first etching back process and before the second etching back process.

Manufacturing method of semiconductor structure

A light-erasable embedded memory device and a method for manufacturing the same are provided in the present invention. The light-erasable embedded memory device includes a substrate with a memory region and a core circuit region, a floating gate on the memory region of the substrate, at least two light-absorbing films above the floating gate, wherein each light-absorbing film is provided with at least one dummy via hole overlapping the floating gate, and a dielectric layer on each light-absorbing film and filling up the dummy via holes.

Light-erasable embedded memory device and method of manufacturing the same

A non-volatile memory device includes a substrate, a gate stack structure, an erase gate structure, and a ferroelectric layer. The gate stack structure is disposed on the substrate. The erase gate structure is disposed on the substrate and disposed at a first side of the gate stack structure. The ferroelectric layer is disposed on a sidewall of the gate stack structure, and the ferroelectric layer is disposed between the gate stack structure and the erase gate structure. The ferroelectric layer disposed between the gate stack structure and the erase gate structure may be used to forma negative capacitance effect for amplifying the voltage applied to the erase gate structure. The purpose of reducing power consumption may be achieved accordingly.

Non-volatile memory device and manufacturing method thereof

A light-erasable embedded memory device and a method for manufacturing the same are provided in the present invention. The light-erasable embedded memory device includes a substrate with a memory region and a core circuit region, a floating gate on the memory region of the substrate, at least one light-absorbing film above the floating gate, wherein at least one light-absorbing film is provided with dummy via holes overlapping the floating gate, and a dielectric layer on the light-absorbing film and filling up the dummy via holes.

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Singapore, Singapore

Chow Yee Lim