St Assembly Test Services Inc.

Chow Seng Guan

John Briar

Elstan Anthony Fernandez

Loreto Ycong Cantillep

A method of fabricating a die-up laminated PBGA package, including the following steps. A mold chase for a PBGA package is provided. The mold chase has an open side with and exposed bottom wall and side walls, and a bottom side. The mold chase is positioned open side up. A heat spreader is dropped into the mold chase open side. The heat spreader has a lower protruding section, and lateral peripheral flanges with gaps therebetween. The protruding section contacts a portion of the bottom wall of the mold chase and the flanges contact a portion of the exposed side walls of the mold chase to thereby secure the heat spreader within the mold chase. A substrate, having a die affixed thereto in a die down position, is fixedly placed over the mold chase. The die being positioned within the space above the protruding section of the heat spreader. A flowable molding compound is applied within the space above the heat spreader and within the space below the heater spreader flanges completely filling these spaces to form a die-up laminated PBGA package. The flowable molding compound is also flowable through the gaps.

Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages

A new method is provided for the connection of heat conducting copper pads, eliminating the need for these heat conducting pads to be connected directly to the ground ring, further eliminating the need for the ground ring to be the external ring that is provided on a surface of the package.

Growing community of inventors

Singapore, Singapore

Chow Seng Guan