Samsung Electronics Co., Ltd.

Choul-Su Kim

Masaharu Tsukue

Woo-Sik Kim

Byung-Woo Woo

Masaharu Sukue

Woo-Sig Kim

Woo-sik Kim

Gun-Yong Lee

Kyung-Soo Han

Byung-woo Woo

Sang-Beom Sim

Sung-Beom Sim

An improved method for mounting tape carrier package type integrated circuits on printed circuit boards. In the method, some of leads of the integrated circuit are preliminarily soldered with corresponding lead pattern on the printed circuit board after the integrated circuit is aligned on the printed circuit board so that the integrated circuit is prevented from being disordered while the printed circuit board including the integrated circuit aligned thereon is transferred to a soldering apparatus.

Method for mounting integrated circuits on printed circuit boards

Disclosed is a method of preventing a gold plate connector of a printed circuit board (PCB) from being contaminated during a soldering process. The disclosed method prevents the gold plate connector coupled with the printed circuit board from being contaminated during wave soldering of the printed circuit board after spreading flux over the printed circuit board on which electronic components are mounted, and the method includes the steps of: forming a strip mask in a form of a membrane by solidifying a masking solution after spreading the masking solution capable of being solidified over the gold plate connector of the printed circuit board, performing the spreading of the masking solution before the spreading of the flux; and removing the strip mask from the gold plate connector after performing the wave soldering. As a result, it is not necessary to perform a washing operation of the gold plate connector. The washing operation can be troublesome, time-consuming, and inconvenient. The present invention causes the time required for performing an entire process upon the printed circuit board to be shortened, and productivity and efficiency to be enhanced.

Method for preventing a gold plate connector on a PCB from being contaminated

A method for mounting an integrated circuit having a plurality of leads on a PCB. In order to mount the integrated circuit having a plurality of leads on the PCB, foreign substance on the PCB is first removed and a flux is simultaneously spread over the lead patterns formed on the PCB. After that, by aligning the leads of the integrated circuit with lead patterns on the PCB on which the flux is spread, some leads of the integrated circuit is temporarily fixed to the corresponding lead patterns of the PCB. After soldering the leads of the integrated circuit to the lead patterns of the PCB by radiating an optical beam on the entire whole surface, the soldered PCB is cooled, thereby mounting the integrated circuit on the PCB.

Method for mounting an integrated circuit from a tape carrier package on

A tape for use in estimating how many electronic parts being fed to an electronic part inserting machine remain on the tqape and a system for using the same. More particularly, a system which counts the remaining electronic parts on the end portion of the tape and sets up a most suitable time that the presently used tape should be replaced with a new one so that the system dead time which may occur during the replacement of tape rolls is remarkably reduced. This tape includes a mark formed at the beginning of an end portion of the tape where some electronic parts are left to be fed to the electronic part inserting machine, and the mark is sensed by a sensor so that the count starts when the end portion of the tape is sensed. The electronic parts inserting machine employing this tape is comprised of a memory for storing a value corresponding to the number of remaining parts attached to the end portion of the tape, a counter for counting down from the number stored in the memory as each remaining part is used, a displayer for displaying the count value generated by the counter, and an CPU for controlling the memory and the counter.

Tape having electronic elements thereon and system for using the same

Any one of at least two holding blocks loaded in a holding block storing portion is picked up and moved to cover an IC on a PCB of a PCB array. A light beam is applied to the whole surface of the PCB. The holding block is moved from the PCB to the holding block storing portion and cooled. It is then determined whether any other PCB to be soldered exists in the PCB array. If it is determined that any other PCB to be soldered exists in the PCB array, another holding block is picked up from the holding block storing portion and moved to cover an IC on the PCB of the PCB array. The above steps are repeated until all the PCBs of the PCB array to be soldered are completely soldered. If it is determined that any other PCB to be soldered does not exist in the PCB array, the PCB array is transferred to a subsequent process.

Method for soldering integrated circuits

A method of mounting an integrated circuit having a plurality of leads on a printed circuit board (PCB), by: removing foreign substances on the PCB; spreading a flux on lead patterns formed on the PCB; aligning the leads of the integrated circuit on the lead patterns on the PCB on which the flux is spread; soldering the leads and lead patterns by covering the part of a semiconductor chip of the aligned integrated circuit using a holding block and radiating an optical beam onto the whole surface thereof; and cooling the holding block and PCB which has been soldered, which prevents shorts and a poor contact generated by an earlier method. As the quality of soldering is enhanced and the lead is not pressured when soldering, the confidence of the integrated circuit after mounting is also enhanced. Moreover, by soldering all of the leads at one time, the operational time can be reduced.

Method of mounting an integrated circuit on a printed circuit board

A method for washing metal masks using a cleaning liquid includes the steps of washing the metal masks before a solder printing process on printed circuit boards, washing the metal masks at least once during the solder printing process and washing the metal masks after completing the last solder printing process. The washing liquid has a composition consisting of from 1 to 5% by weight of a fluorine-based surfactant and from 95 to 99% by weight of isopropyl alcohol, the some of the constituents being 100% by weight. More preferably, the cleaning liquid is a composition consisting of 2% by weight of the fluorine-based surfactant and 98% by weight of isopropyl alcohol, the some of the constituents being 100% by weight.

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Kyonggi-do, South Korea

Choul-Su Kim