Nitto-Denko Corporation

Chouhei Okuno

Masayuki Yamamoto

A workpiece is unloaded from a wafer-receiving container. A first discriminating sensor detects a front surface of the workpiece, and determines either a semiconductor wafer or a spacer is the workpiece. Where the workpiece is a wafer, the first discriminating sensor also determines whether or not a protective tape is on the front surface of the workpiece. Where it is determined that a protective tape is not on the front surface, a second discriminating sensor detects a back surface of the wafer for discriminating the presence or absence of the protective tape.

Semiconductor wafer mounting method and semiconductor wafer mounting apparatus

A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.

Method and apparatus for separating protective tape

A receiver base receives from below a front end portion of a label that is fed forward from a folded-back portion of an release paper and droops forward, so that the label is held in a predetermined forwardly and downwardly inclined posture. In a process of separating and feeding the label in such a state where part of a rear end of the label is joined and held onto the release paper, a suction head having a downward suction surface that is inclined forward and downward is brought closer to a top surface of the label being separated so as to suck the label.

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Ibaraki, Japan

Chouhei Okuno