Unitech Printed Circuit Board Corporation

Chou Cheng Hsien

The present invention discloses a modular method for manufacturing circuit boards, which is a method of manufacturing multilayer printed circuit boards with blind and buried vias structure by using basic components as the assembly units. The method comprises the steps of producing electric circuits on the surface of a copper clad laminate by photolithographic and etching methods, pressing a dry film dielectric onto the surface of the laminate by the dry film lamination method after the electric circuit layer is formed, drilling a via and plugging a plastic conductive material into the via to obtain a basic component. When a multilayer printed circuit board having the blind and buried via structure is manufactured, the basic component serves as an assembling unit to stack with other circuit board having blind via and single-sided or double-sided electric circuits according to the multilayer circuit board mode to perform a heating and pressurization procedure and form a multilayer circuit board with blind and buried via structure. Such arrangement not only saves the time for aligning layers, pressing and blind via filled plating of the prior-art technology, but also enhances the yield rate and reduces the failure cost.

Growing community of inventors

Chung-He, Taiwan

Chou Cheng Hsien