Kabushiki Kaisha Toshiba

Nec Corporation

Nuflare Technology, Inc.

Chosaku Noda

Hideo Ando

Yutaka Kashihara

Yutaka Okamoto

Koichi Hirayama

Akihito Ogawa

Kazuto Kuroda

Kazuo Watabe

Yuji Nagai

Yutaka Yamanaka

Hideaki Ohsawa

Hiroharu Satoh

Kinji Kayanuma

Riki Ogawa

Masataka Shiratsuchi

Toshiaki Iwanaga

Masaaki Matsumaru

Hiroharu Sato

Masahiro Saito

Hisashi Yamada

Naomasa Nakamura

Naoki Morishita

Takashi Usui

Hideo Tsuchiya

Masatsugu Ogawa

Ryuichi Katayama

Koichi Ishii

Toshihiro Sugaya

Keiichiro Yusu

Hideki Takahashi

Yoshiyuki Ishizawa

Ryoichi Hirano

Toshihiko Kaneshige

Sumitaka Maruyama

Hideaki Hashimoto

Tatsunori Ide

Kazuhiro Nakashima

Nobuhisa Yoshida

Minoru Akiyama

Nobuaki Kaji

Daisuke Eto

Takeharu Shibatoko

Tadayuki Sugimori

Nobumasa Naito

A pattern inspection apparatus includes a secondary electron image acquisition mechanism to include a deflector deflecting multiple primary electron beams and a detector detecting multiple secondary electron beams, and acquire a secondary electron image corresponding to each of the multiple primary electron beams by scanning a target object with a pattern thereon with the multiple primary electron beams by the deflector, and detecting the multiple secondary electron beams from the target object by the detector, a storage device to store individual correction kernels each generated for individually adjusting a secondary electron image corresponding to each primary electron beam concerning a reference pattern to be commensurate with a reference blurred image, and a correction circuit to correct, by correspondingly using the individual correction kernel, the secondary electron image corresponding to each primary electron beam acquired from the inspection target object.

Pattern inspection apparatus and pattern inspection method

A multiple electron beam image acquisition method includes performing scanning with a representative secondary electron beam emitted, based on temporary secondary electron beam deflection conditions, for each of plural positions in a primary electron beam deflection range of a representative primary electron beam, acquiring plural coordinates corresponding to the plural positions, based on detected images of the representative secondary electron beam, each detected at any one of the plural positions in the primary electron beam deflection range of the representative primary electron beam, and calculating, using the plural coordinates acquired, secondary electron beam deflection conditions to cancel movement of the representative secondary electron beam due to movement of the representative primary electron beam in the primary electron beam deflection range of the representative primary electron beam and to fix the irradiation position of the representative secondary electron beam to the predetermined detection element.

Multiple electron beam image acquisition method, multiple electron beam image acquisition apparatus, and multiple electron beam inspection apparatus

A beam arrangement portion is provided to arrange multiple primary electron beams on a substrate. The beam arrangement portion arranges the multiple primary electron beams in a square lattice along a first moving direction of a stage allowing the substrate to be placed thereon and a second moving direction perpendicular to the first moving direction in a state where, when the multiple primary electron beams are viewed as a whole, beams around four corners of the square lattice are omitted.

Multiple electron-beam image acquisition apparatus and multiple electron-beam image acquisition method using beam arrangement with omitted corners in a scan direction

According to one aspect of the present invention, a pattern inspection apparatus includes: a first sub-pixel interpolation processing circuitry configured to calculate a pixel value of a reference image corresponding to a position of each pixel of the inspection target image by performing an interpolation process using at least one pixel value of the reference image for each shift amount while variably and relatively shifting the inspection target image and the reference image by the unit of a sub-pixel using the reference image corresponding to the inspection target image; and an SSD calculation processing circuitry configured to calculate a sum of squared difference between each pixel value of the inspection target image and a corresponding pixel value of the reference image subjected to a filter process for the each shift amount.

A charged particle beam inspection method conducted by disposing a sample on a stage and by performing a first scanning in a first beam scanning area on the sample by using one first charged particle beam out of a plurality of charged particle beams while the stage is moved so that a first inspection of a first inspection unit in the first beam scanning area is performed, and by performing a second scanning in a second beam scanning area on the sample by using one second charged particle beam out of the charged particle beams while the stage is moved so that a second inspection of a second inspection unit in the second beam scanning area is performed.

Charged particle beam inspection method

A charged particle beam inspection apparatus includes a first deflector to deflect N&#xd7;N' multiple beams collectively to N&#xd7;N&#x2032; small regions having a size p/M in the first direction and arrayed at the pitch p in the first direction, perform tracking deflection, and re-deflect the multiple beams collectively to next N&#xd7;N&#x2032; small regions away from the N&#xd7;N&#x2032; small regions by N small regions in the first direction, by the stage completes a movement of a distance of N/M&#xd7;p so as to reset the tracking deflection; and a second deflector to deflect the multiple beams collectively to scan the N&#xd7;N&#x2032; small regions concerned while the tracking deflection is performed.

Charged particle beam inspection apparatus and charged particle beam inspection method

According to one embodiment, an optical recording head device includes a light source which outputs such a relaxation oscillation optical pulse that a full width at half maximum of a single pulse is 820 ps or less, a driving unit for driving the light source, an objective lens which converges emission light from the light source on a recording layer of a recording medium, and captures reflective light which is reflected by the recording layer of the recording medium, a distribution unit, placed between the light source and the objective lens, for distributing incident light, and a photodetection unit for receiving via the distribution unit the reflective light which is reflected by the recording layer of the recording medium, wherein a resonator length of the light source is 6560 &#x3bc;m or less.

Optical recording head device, optical recording apparatus, and recording method

According to one embodiment, a first encoder encodes main information, a second encoder encodes sub-information, a first modulator modulates a carrier based on an output of the first encoder, a duplicating module duplicates an output of the second encoder to generate encoded sub-information units, and a second modulator amplitude-modulates an output of the first modulator based on the encoded sub-information units. The second modulator amplitude-modulates with &#x3c3;/(&#x3bc;&#xd7;(2)) being 0.4 or less, wherein a noise power of a transmission path or a storage medium is &#x3c3;, a number of the encoded sub-information units is N, signal levels after amplitude modulation, which correspond to bitand bitof the encoded sub-information units, are A and B, and a level difference A&#x2212;B is &#x3bc;.

Signal processing system and information storage medium

The length of a format modulation area in an address segment is limited to be 25% of the address-segment length or less, and the position of the format modulation area is selectable two possible positions. Subsequently, where a CLV optical-disk medium is used, wobble modulation areas in adjacent recording tracks do not overlap each other in the radius direction.

Optical disk medium and optical disk apparatus

In order to select the latest defect management information, the latest selection information first is selected by searching a plurality of selection information areas for a currently active selection information area in which the latest selection information is recorded and subsequently the latest defect management information is obtained by searching a plurality of defect management areas for a currently active defect management area in which the latest defect management information is recorded. If there is no unused defect management area in which defect management information can be alternatively recorded in lieu of the currently active defect management area, recording operation is limited.

Defect information managing method, information recording and/or reproducing apparatus, and information reproducing apparatus

There is provided an information management apparatus which can make it impossible to read out data recorded on a write-once type recordable optical disk as required and the usefulness thereof is enhanced. When recorded data is destroyed on the write-once type recordable optical disk, data modulated by a modulation system of the same run length restriction as run length restriction of a modulation system used for recording data is overwritten and recorded, data is overwritten and recorded by use of patterns in which the frequency of occurrence of spaces of the longest code is higher than the frequency of occurrence of the modulation system used for recording data, or data is overwritten and recorded by use of successive patterns of the shortest code in the run length restriction of the modulation system used for recording data.

Information recording medium, information recording/reproducing apparatus and information management method

To improve the sync code detection reliability while simplifying the sync code position detection process, when a first pattern as a combination of three successive sync codes is compared with a second pattern in which the allocation of sync codes is shifted by one code from the first pattern, two or more sync codes are changed.

Sync frame structure, information storage medium, information recording method, information reproduction method, information reproduction apparatus

Address information is formed by M wobbles (integer M is the number of wobble waves) per bit as a basic unit, and is NRZ-recorded. Also, a sync signal used in sync detection of the address information is formed by N wobbles per bit as a basic unit (integer N is the number of wobble waves and M=2N). The sync signal with such configuration (6 wobbles per bit) is recorded on the head side of the address information (12 wobbles per bit). In this way, even when external noise is large, a modulated wobble signal can be demodulated more accurately.

Optical disc with wobbled tracks and apparatus using this optical disc

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Kawasaki, Japan

Chosaku Noda