Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Choonkeun Lee

Han Bit Kim

Youngju Lee

Junghyun Lee

Hyungkyu Kim

Changhyun Yoon

Sanghyun Kwon

Seungon Kang

Seong-Chan Park

Seongchan Park

A semiconductor package includes: a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface opposite to the active surface; a heat-dissipating member disposed on the inactive surface of the semiconductor chip and including graphite; an encapsulant sealing at least a portion of each of the semiconductor chip and the heat-dissipating member; a capping metal layer disposed directly between the heat-dissipating member and the encapsulant; and a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad, wherein the heat-dissipating member includes holes passing through at least a portion of the heat-dissipating member, and the holes overlap the inactive surface of the semiconductor chip.

Semiconductor package

An insulating film includes an insulating layer and a surface bonding layer disposed on the insulating layer. The surface bonding layer includes a radical generation element and a coordinate bond element. In the surface bonding layer, a/b is 0.05 or more and 0.35 or less, in which 'a' is an atom content of the coordinate bond element and 'b' is an atom content of the radical generation element.

Insulating film and printed circuit board including the same

Growing community of inventors

Suwon-si, South Korea

Choonkeun Lee