Semes Co., Ltd.

Choongki Min

Soo Hyun Cho

Min Jung Park

Jung Yul Lee

Ki Seung Lee

Kyungjin Seo

Younghun Jung

Okseong Lee

Eun Saem Ahn

The inventive concept relates to an apparatus and method for forming a film on a substrate by spin coating. The apparatus includes liquid dispensing units that dispense processing liquids to form liquid films on the first and second substrates, respectively, air-flow supply units that form downward air flows in the first and second spaces, respectively, and a controller that controls the liquid dispensing units and the air-flow supply units. Each of the liquid dispensing units includes a pre-treatment nozzle that dispenses a pre-treatment liquid and a coating solution nozzle that dispenses a coating solution onto a corresponding one of the first and second substrates. The controller controls the liquid dispensing units to dispense the pre-treatment liquids and thereafter the coating solutions onto the first and second substrates and adjusts supply states of the downward air flows according to amounts of the pre-treatment liquids dispensed.

Apparatus and method for processing substrate

The inventive concept provides a substrate treating apparatus and a substrate treating method. The sub substrate treating apparatus may include a support unit that supports a substrate, a liquid supply unit that supplies a liquid onto the substrate supported by the support unit, and a controller that controls the liquid supply unit and the support unit, the liquid supply unit may include a pre-treatment nozzle that discharges a first treatment liquid in a stream scheme, and a main nozzle that discharges a second treatment liquid in a liquid curtain scheme, and the controller may control the support unit such that a rotational direction of the substrate when the first treatment liquid is discharged from the main nozzle and a rotational direction of the substrate when the second treatment liquid is discharged from the pre-treatment nozzle are opposite to each other.

Substrate treating apparatus and substrate treating method

The inventive concept provides an apparatus and a method for heat-treating a substrate. The method includes a first treatment operation of spacing a substrate apart from a support plate provided with a heater to a first height in a state in which a treatment space, in which the substrate is treated, is closed and heating the substrate, a second treatment operation of, after the first treatment operation, lowering the substrate such that the substrate is located at a second height and heating the substrate, a third treatment operation of, after the second treatment operation, lifting the substrate such that the substrate is spaced apart from the support plate to be located at a third height and heating the substrate, and a fourth treatment operation of, after the third treatment operation, lowering the substrate such that the substrate is located at a fourth height and heating the substrate.

Method and apparatus for treating substrate

Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a support unit provided to support the substrate and rotate the substrate; a treatment liquid nozzle for supplying the treatment liquid onto the substrate supported by the support unit; a pre-wet liquid nozzle for supplying a pre-wet liquid onto a substrate supported by the support unit; and a controller for controlling the treatment liquid nozzle and the pre-wet liquid nozzle, wherein the controller controls the treatment liquid nozzle and the pre-wet liquid nozzle to perform a pre-wet step for supplying the pre-wet liquid to the substrate, and then a treatment liquid supply step for supplying the treatment liquid to the substrate and supplying the pre-wet liquid to the substrate during the supplying the treatment liquid to the substrate.

Apparatus and method for treating substrate

Disclosed are a method and an apparatus for applying a liquid onto a substrate. The method for treating a substrate, the method includes: a liquid supplying step of supplying a treatment liquid for forming a liquid film on the substrate while rotating the substrate; and a liquid diffusing step of diffusing the treatment liquid discharged to the substrate by rotating the substrate, after the liquid supplying step. The liquid diffusing step includes: a primary diffusion step of rotating the substrate at a first diffusion speed; and a secondary diffusion step of rotating the substrate at a second diffusion speed, after the primary diffusion step. The second diffusion speed is higher than the first diffusion speed. Accordingly, the treatment liquid can be applied to the substrate again by performing the secondary diffusion step, making it possible to adjust the thickness of a photosensitive film.

Growing community of inventors

Cheonan-si, South Korea

Choongki Min