Samsung Electronics Co., Ltd.

Choongbo Shim

Heejin Kim

Ilyoung Han

Mingi Hong

Nungpyo Hong

In a method of determining a critical temperature of a semiconductor package, heat is applied to at least one semiconductor package. Temperatures of the semiconductor package are measured during the heating. Heights of the semiconductor package are also measured during the heating. A temperature of the semiconductor package measured at a point at which a height from among the measured heights of the semiconductor package is sharply increased so that swelling of the semiconductor package occurs is determined as the critical temperature of the semiconductor package. Thus, the critical temperature of the semiconductor package may be accurately determined.

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ASAN-SI, South Korea

Choongbo Shim