Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Choong Hoe Kim

Min Ho Kim

Yang Gyoo Jung

Dong Soo Ryu

Tae Ho Yoon

Youn Seok Song

Dong Su Ryu

Choon Heung Lee

Ju Hoon Yoon

Seok Ho Na

Chan Ha Hwang

Yun Seok Song

Woo Kyung Ju

Dong Hyeon Park

A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

Laser-assisted bonding apparatus for bonding an electronic device to a substrate

In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.

Hybrid bonding interconnection using laser and thermal compression

System and method for laser assisted bonding of an electronic device

System and method for laser assisted bonding of semiconductor die

Laser assisted bonding for semiconductor die interconnections is disclosed and may, for example, include forming flux on a circuit pattern on a circuit board, placing a semiconductor die on the circuit board where a bump on the semiconductor die contacts the flux, and reflowing the bump by directing a laser beam toward the semiconductor die. The laser beam may volatize the flux and make an electrical connection between the bump and the circuit pattern. A jig plate may be placed on the semiconductor die when the laser beam is directed toward the semiconductor die. Warpage may be reduced during heating or cooling of the semiconductor die by applying pressure to the jig plate. Jig bars may extend outward from the jig plate and may be in contact with the circuit board during the application of pressure to the jig plate. The jig plate may comprise one or more of: silicon, silicon carbide, and glass.

Laser assisted bonding for semiconductor die interconnections

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Seoul, South Korea

Choong Hoe Kim