Saedge Vision Solutions Pte. Ltd.

Choong Fatt Ho

Victor Vertoprakhov

Soon Wei Wong

Ah Kow Chin

There is provided an apparatus and method for inspecting a semiconductor package. The apparatus includes at least one 3D camera positioned at a first angle relative to a normal axis of the semiconductor package; and a light source configured to provide illumination for the at least one 3D camera, the light source being directed at the semiconductor package. The method includes casting a shadow of a bonded wire onto the semiconductor package; obtaining a 3D image of the semiconductor package; determining a distance S of the shadow and the bonded wire in the image; and obtaining a wire loop height H of the bonded wire.

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Singapore, Singapore

Choong Fatt Ho