Stmicroelectronics Gmbh

Choon Lee Lai

David Gani

Wee Chin Judy Lim

Hk Looi

Cheng-hai Cheh

Bs Aw

Tin-Tun Maung

Described herein are various embodiments of contacts that include different portions angled with respect to one another and methods of manufacturing devices that include such contacts. In some embodiments, a module may include a first portion of a contact that is disposed within a housing and a second portion that is disposed outside of the housing, with the second portion angled with respect to the first portion. Manufacturing such devices may include depositing a conductive material to electrically connect the contact to a contact pad of a substrate. In some embodiments, a deposition process for depositing the conductive material may have a minimum dimension, which defines a minimum dimension of a conductive material once deposited. In some such embodiments, a distance between a terminal end of the contact pin and the contact pad may be greater than the minimum dimension of the deposition process.

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Singapore, Singapore

Choon Lee Lai