Samsung Electronics Co., Ltd.

Choo-ho Kim

Hun-Yong Park

Eui-seok Kim

Won-soo Ji

Hyun-Ho Kim

Dae-young Kim

Won Soo Ji

Dong-hun Lee

Ho-Jae Byon

Yong-Kyun Sun

Won-ho Jung

Shin-min Rhee

Sang-kyu Bang

Soo-hyun Cho

Jomg-o Lim

Yong-rak Jeong

Jung-Hwan Woo

Dae-seo Park

Jae-Bong Shin

Ka-ram Lee

Youn-Sung Ko

Sang Kyu Bang

Ho-moon Lee

Sung Don Kwak

Jin-ki Hong

Hee-young Jun

A method of manufacturing a light-emitting apparatus includes disposing a substrate on a support; disposing a light-emitting package including a light-emitting device on the substrate so as to allow the light-emitting package to be positioned at a target position on the substrate; applying energy to the light-emitting package to make the light-emitting device emit light; and analyzing the light that is emitted from the light-emitting device due to the energy, and determining a position where the light-emitting package is actually disposed. Thus, the light-emitting apparatus may be easily and inexpensively manufactured, and may generate a limited number of spots and provide improved uniform brightness.

Method of manufacturing light-emitting apparatus, light-emitting module inspecting apparatus, and method of determining whether light-emitting module meets quality requirement

A phosphor dispenser includes: a nozzle having a space for accommodating the phosphor liquid, wherein an opening for ejecting the phosphor liquid is connected to the space; and a tappet reciprocally movable with respect to the nozzle to eject the phosphor liquid in the space through the nozzle, wherein the tappet includes a cylindrical unit having a cylindrical shape and a convex unit having a hemispherical shape that is convex towards the nozzle from the cylindrical unit, and the convex unit is formed of polycrystalline diamond (PCD).

Phosphor dispenser

A light-emitting device package may include a pre-mold and a molding member. The pre-mold may include an upper body having a inclined (e.g., concavely) plane from which a plurality of vertical holes passing through the upper body are formed and a lower body having an upper surface that meets the inclined (e.g., concavely) plane under the upper body to form a concave unit. The molding member may fill the plurality of vertical holes and the concave unit.

Light-emitting device package

A method of cutting light emitting element packages includes preparing a ceramic substrate having a surface on which a plurality of light emitting element chips are mounted and a light-transmitting material layer is formed to cover the plurality of light emitting element chips; partially removing the light-transmitting material layer between the plurality of light emitting element chips along a cutting line by using a mechanical cutting method; and separating individual light emitting element packages by cutting the ceramic substrate along the cutting line by using a laser cutting method.

Method of cutting light emitting element packages employing ceramic substrate, and method of cutting multilayered object

There is provided a slit valve unit including: a body disposed on an outer side of a process chamber and having an entrance connected to an opening of the process chamber; a slit valve provided in an internal space of the body and selectively opening and closing the entrance; a plurality of packing members provided along the circumference of the entrance on an inner side of the body and tightly attached to the slit valve when the slit valve shields the entrance; and a connection pipe having one end exposed between the plurality of packing members on the inner side of the body so as to be connected to an airtight space formed among the plurality of packing members, the body, and the slit valve, and the other end exposed to the outer side of the body, the connection pipe penetrating the body.

Slit valve unit and film forming apparatus having the same

Methods of forming through-silicon vias by using laser ablation. A method includes, laser drilling to form a plurality of grooves by irradiating a laser beam onto an upper surface of a silicon wafer, and grinding a lower surface of the silicon wafer to form a plurality of through-silicon vias by exposing the grooves on the lower surface of the silicon wafer.

Method of forming through-silicon via using laser ablation

A light-emitting device package mold and a method of manufacturing a lens of a light-emitting device package. The light-emitting device package mold includes a convex unit, an inner circumference of which has a hemispherical shape; a flat panel unit that forms a flat panel by extending from an edge of the convex unit; a cylindrical unit extending in a vertical direction with respect to an upper surface of the flat panel unit; and an injection hole and a discharge hole that penetrate through the convex unit, wherein the discharge hole is formed in a horizontal direction with respect to the flat panel unit.

Mold for light-emitting device package

Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.

Die attaching apparatus

Growing community of inventors

Gyeonggi-do, South Korea

Choo-ho Kim